电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS8662D09E-250

产品描述DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
产品类别存储    存储   
文件大小1MB,共35页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS8662D09E-250概述

DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

GS8662D09E-250规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明15 X 17 MM, 1 MM PITCH, FPBGA-165
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间0.45 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)250 MHz
I/O 类型SEPARATE
JESD-30 代码R-PBGA-B165
长度17 mm
内存密度75497472 bit
内存集成电路类型DDR SRAM
内存宽度9
湿度敏感等级3
功能数量1
端子数量165
字数8388608 words
字数代码8000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8MX9
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.5/1.8,1.8 V
认证状态Not Qualified
座面最大高度1.5 mm
最大待机电流0.27 A
最小待机电流1.7 V
最大压摆率0.75 mA
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15 mm
Base Number Matches1

文档预览

下载PDF文档
GS8662D08/09/18/36E-250/200/167
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 9Mb, 18Mb, and 36Mb and
144Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
72Mb SigmaQuad-II
Burst of 4 SRAM
Clocking and Addressing Schemes
250 MHz–167 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
SigmaQuad™ Family Overview
The GS8662D08/09/18/36E are built in compliance with the
SigmaQuad-II SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 75,497,472-bit (72Mb)
SRAMs. The GS8662D08/09/18/36E SigmaQuad SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
.
me
nd
ed
for
Ne
w
Parameter Synopsis
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.50 ns
tKHKH
tKHQV
Rev: 1.10 8/2012
No
t
Re
co
m
1/35
De
sig
n—
Di
sco
nt
inu
ed
Pr
od
u
The GS8662D08/09/18/36E SigmaQuad-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Each internal read and write operation in a SigmaQuad-II B4
RAM is four times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore the address
field of a SigmaQuad-II B4 RAM is always two address pins
less than the advertised index depth (e.g., the 8M x 8 has a 2M
addressable index).
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2005, GSI Technology
监控摄像机系统镜头的安装
镜头的安装方式:有C式和CS式两种,两者的螺纹均为1英寸32牙,直径为1英寸,差别是镜头距CCD靶面的距离不同,C式安装座从基准面到焦点的距离为17.562毫米,比CS式距离CCD靶面多一个专用接圈的长 ......
jek9528 工业自动化与控制
在WINDOWS中用ADS,就不用安装LINUX对不对
可以在PC的windows中使用ADS开发环境开发驱动程序,为什么还要在PC中装LINUX操作系统,当向板子上将Linux内核移植好后,直接在windows中用ADS就可以了,有必要用LINUX吗?...
owen666 Linux开发
HJTAG+AXD怎样才能修改内存数据?
HJTAG+AXD怎样才能修改内存数据? 1. 用本人自制的Wiggler小板将PC与目标板连接,上电后.HJTAG能正确辨认CPU 2. 在目标板LOAD操作系统Wince完成后(可运行应同程序).运行AXD时使用HJTAG.DLL ......
lin62485145 嵌入式系统
MSP的团购需要发帖。。小弟就灌水了
MSP的团购需要发帖。。小弟就灌水了团购的链接:https://www.eeworld.com.cn/eetuan/20111115/index.php...
Helloeveryon 微控制器 MCU
BeagleBone+IAR+Jlink方案如何实现
我现在想用BeagleBone进行裸机开发一款产品,但是我现在纠结的是:Jlink是直接连接Jtag接口的。但是BeagleBone上是通过USb转Jtag实现调试功能的。现在不知道怎么把Jlink用在IAR上了,请大神指教 ......
zhouhao15917 DSP 与 ARM 处理器
增强的多功能铺铜管理器
详见 75671...
520spxiong PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2626  2419  1941  1772  1172  46  9  52  4  25 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved