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CY7C1321V18-200BZC

产品描述DDR SRAM, 512KX36, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
产品类别存储    存储   
文件大小561KB,共22页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C1321V18-200BZC概述

DDR SRAM, 512KX36, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

CY7C1321V18-200BZC规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
Base Number Matches1

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PRELIMINARY
CY7C1317V18
CY7C1319V18
CY7C1321V18
18-Mb DDR™-II SRAM
4-Word Burst Architecture
Features
• 18-Mb density (2M x 8, 1M x 18, 512K x 36)
• 250-MHz clock for high bandwidth
• 4-Word burst for reducing address bus frequency
• Double Data Rate (DDR™) interfaces (data transferred
at 500 MHz) @ 250 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) account for clock skew
and flight time mismatching
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Synchronous internally self-timed writes
• 1.8V core power supply with HSTL inputs and outputs
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–V
DD
)
• 13 x 15 mm 1.0-mm pitch fBGA package, 165-ball
(11 x 15 matrix)
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement.
Functional Description
The CY7C1317V18/CY7C1319V18/CY7C1321V18 are 1.8V
Synchronous Pipelined SRAM equipped with DDR-II (Double
Data Rate) architecture. The DDR-II consists of an SRAM core
with advanced synchronous peripheral circuitry and a two-bit
burst counter. Addresses for Read and Write are latched on
alternate rising edges of the input (K) clock. Write data is regis-
tered on the rising edges of both K and K. Read data is driven
on the rising edges of C and C if provided, or on the rising edge
of K and K if C/C are not provided. Each address location is
associated with four 8-bit words in the case of CY7C1317V18
that burst sequentially into or out of the device. The burst
counter always starts with “00” internally in the case of
CY7C1317V18. On CY7C1319V18 and CY7C1321V18, the
burst counter takes in the last two significant bits of the
external address and bursts four 18-bit words in the case of
CY7C1319V18, and four 36-bit words in the case of
CY7C1321V18, sequentially into or out of the device.
Asynchronous inputs include impedance match (ZQ).
Synchronous data outputs (Q, sharing the same physical pins
as the data inputs, D) are tightly matched to the two output
echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR-II SRAM in the
system design. Output data clocks (C/C) enable maximum
system clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Configurations
CY7C1317V18 – 2M x 8
CY7C1319V18 – 1M x 18
CY7C1321V18 – 512K x 36
Logic Block Diagram (CY7C1317V18)
A
(18:0)
LD
K
K
DOFF
Write Add. Decode
Read Add. Decode
19
Address
Register
Write Write Write Write
Reg
Reg
Reg Reg
512K x 8 Array
512K x 8 Array
512K x 8 Array
512K x 8 Array
8
Output
Logic
Control
R/W
C
C
CLK
Gen.
Read Data Reg.
32
Control
Logic
16
16
Reg.
Reg.
8
Reg.
CQ
CQ
8
V
REF
R/W
NWS
[1:0]
DQ
[7:0]
Cypress Semiconductor Corporation
Document #: 38-05178 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised February 7, 2004

CY7C1321V18-200BZC相似产品对比

CY7C1321V18-200BZC CY7C1319V18-167BZC CY7C1321V18-250BZC CY7C1317V18-167BZC CY7C1319V18-250BZC CY7C1317V18-200BZC CY7C1317V18-250BZC CY7C1319V18-200BZC CY7C1321V18-167BZC
描述 DDR SRAM, 512KX36, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 1MX18, 0.4ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 512KX36, 0.35ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 2MX8, 0.4ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 1MX18, 0.35ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 2MX8, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 2MX8, 0.35ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 1MX18, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 DDR SRAM, 512KX36, 0.4ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
针数 165 165 165 165 165 165 165 165 165
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Base Number Matches 1 1 1 1 1 1 1 - -

 
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