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TLV277x, TLV277xA
FAMILY OF 2.7 V HIGH SLEW RATE RAIL TO RAIL OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
D
D
D
D
D
D
D
D
High Slew Rate . . . 10.5 V/µs Typ
High-Gain Bandwidth . . . 5.1 MHz Typ
Supply Voltage Range 2.5 V to 5.5 V
Rail-to-Rail Output
360
µV
Input Offset Voltage
Low Distortion Driving 600-Ω
0.005% THD+N
1 mA Supply Current (Per Channel)
17 nV/√Hz Input Noise Voltage
D
D
D
D
D
2 pA Input Bias Current
Characterized From T
A
= −55°C to 125°C
Available in MSOP and SOT-23 Packages
Micropower Shutdown Mode . . . I
DD
< 1
µA
Available in Q-Temp Automotive
High Reliability Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
description
The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output
swing, high output drive, and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz
of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher
than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these
devices a good choice for driving the analog input or reference of analog-to-digital converters. These devices
also have low distortion while driving a 600-Ω load for use in telecom systems.
These amplifiers have a 360-µV input offset voltage, a 17 nV/√Hz input noise voltage, and a 2-pA input bias
current for measurement, medical, and industrial applications. The TLV277x family is also specified across an
extended temperature range (−40°C to 125°C), making it useful for automotive systems, and the military
temperature range (−55°C to 125°C), for military systems.
These devices operate from a 2.5-V to 5.5-V single supply voltage and are characterized at 2.7 V and 5 V. The
single-supply operation and low power consumption make these devices a good solution for portable
applications. The following table lists the packages available.
FAMILY PACKAGE TABLE
DEVICE
TLV2770
TLV2771
TLV2772
TLV2773
TLV2774
TLV2775
NUMBER
OF
CHANNELS
1
1
2
2
4
4
PACKAGE TYPES
SHUTDOWN
PDIP
8
—
8
14
14
16
CDIP
—
—
8
—
—
—
SOIC
8
8
8
14
14
16
SOT-23
—
5
—
—
—
—
TSSOP
—
—
8
—
14
16
MSOP
8
—
8
10
—
—
LCCC
—
—
20
—
—
—
CPAK
—
—
10
—
—
—
Yes
—
—
Yes
—
Yes
Refer to the EVM
Selection Guide
(Lit# SLOU060)
UNIVERSAL
EVM BOARD
A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS†
DEVICE
TLV277X
TLV247X
TLV245X
VDD
(V)
2.5 − 6.0
2.7 − 6.0
2.7 − 6.0
BW
(MHz)
5.1
2.8
0.22
6.4
SLEW RATE
(V/µs)
10.5
1.5
0.11
1.6
IDD (per channel)
(µA)
1000
600
23
550
RAIL-TO-RAIL
O
I/O
I/O
I/O
TLV246X
2.7 − 6.0
† All specifications measured at 5 V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
Copyright
1998−2004, Texas Instruments Incorporated
On products compliant to MIL PRF 38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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1
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
TLV277x, TLV277xA
FAMILY OF 2.7 V HIGH SLEW RATE RAIL TO RAIL OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
TLV2770 and TLV2771 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
(mV)
2.5
2.5
−40°C to 125°C
1.6
SMALL OUTLINE
(D)
TLV2770CD
TLV2771CD
TLV2770ID
TLV2771ID
TLV2770AID
TLV2771AID
SOT-23
(DBV)
—
TLV2771CDBV
—
TLV2771IDBV
—
—
MSOP
(DGK)
TLV2770CDGK†
—
TLV2770IDGK†
—
—
—
PLASTIC DIP
(P)
TLV2770CP
—
TLV2770IP
—
TLV2770AIP
—
0°C to 70°C
† This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
TLV2772 and TLV2773 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
(mV)
2.5
2.5
−40°C to 125°C
1.6
SMALL OUTLINE
(D)
TLV2772CD
TLV2773CD
TLV2772ID
TLV2773ID
TLV2772AID
TLV2773AID
MSOP
(DGK)
TLV2772CDGK
—
TLV2772IDGK
—
—
—
MSOP
(DGS)
—
TLV2773CDGS
—
TLV2773IDGS
—
—
PLASTIC DIP
(N)
—
TLV2773CN
—
TLV2773IN
—
TLV2773AIN
PLASTIC DIP
(P)
TLV2772CP
—
TLV2772IP
—
TLV2772AIP
—
0°C to 70°C
TLV2774 and TLV2775 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
(mV)
2.7
2.7
−40°C to 125°C
2.1
SMALL OUTLINE
(D)
TLV2774CD
TLV2775CD
TLV2774ID
TLV2775ID
TLV2774AID
TLV2775AID
PLASTIC DIP
(N)
—
TLV2775CN
—
TLV2775IN
—
TLV2775AIN
PLASTIC DIP
(P)
TLV2774CP
—
TLV2774IP
—
TLV2774AIP
—
TSSOP
(PW)
TLV2774CPW
TLV2775CPW
TLV2774IPW
TLV2775IPW
TLV2774AIPW
TLV2775AIPW
0°C to 70°C
TLV2772M/Q AND TLV2772AM/Q AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
(mV)
2.5
−40°C to 125°C
−55°C to 125°C
‡ Available in tape and reel
1.6
2.5
1.6
SMALL
OUTLINE
(D)
TLV2772QD‡
TLV2772AQD‡
TLV2772MD
TLV2772AMD
CHIP CARRIER
(FK)
—
—
TLV2772MFK
TLV2772AMFK
CERAMIC DIP
(JG)
—
—
TLV2772MJG
TLV2772AMJG
CERAMIC
FLATPACK
(U)
—
—
TLV2772MU
TLV2772AMU
TSSOP
(PW)
TLV2772QPW‡
TLV2772AQPW‡
—
—
2
WWW.TI.COM
TLV277x, TLV277xA
FAMILY OF 2.7 V HIGH SLEW RATE RAIL TO RAIL OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
PACKAGE SYMBOLS
PACKAGE TYPE
SOT23
PINS
5 Pin
PART NUMBER
TLV2771CDBV
TLV2771IDBV
TLV2770CDGK
TLV2770IDGK
8 Pin
MSOP
10 Pin
† xx represents the device date code.
TLV2772CDGK
TLV2772IDGK
TLV2773CDGS
TLV2773IDGS
SYMBOL†
VAMC
VAMI
xxTIABO
xxTIABP
xxTIAAF
xxTIAAG
xxTIABQ
xxTIABR
TLV277x PACKAGE PINOUT
TLV2772M AND TLV2772AM
FK PACKAGE
(TOP VIEW)
NC
1IN −
NC
1IN +
NC
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
NC
1OUT
NC
VDD+
NC
NC
2OUT
NC
2IN −
NC
NC − No internal connection
NC
GND
NC
2IN+
NC
WWW.TI.COM
3
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
TLV277x, TLV277xA
FAMILY OF 2.7 V HIGH SLEW RATE RAIL TO RAIL OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
TLV277x PACKAGE PINOUTS
(1)
TLV2770
† OR P PACKAGE
D, DGK
(TOP VIEW)
TLV2771
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN+
1
2
3
4
IN −
5
VDD
TLV2771
D PACKAGE
(TOP VIEW)
NC
IN −
IN +
GND
1
2
3
4
8
7
6
5
SHDN
V
DD
OUT
NC
NC
IN −
IN +
GND
1
2
3
4
8
7
6
5
NC
V
DD
OUT
NC
TLV2772
D, DGK, JG, P, OR PW PACKAGE
(TOP VIEW)
TLV2772M AND TLV2772AM
U PACKAGE
(TOP VIEW)
TLV2773
DGS PACKAGE
(TOP VIEW)
1OUT
1IN −
1IN +
GND
1
2
3
4
8
7
6
5
V
DD
2OUT
2IN −
2IN+
NC
1OUT
1IN −
1IN +
GND
1
2
3
4
5
10
9
8
7
6
NC
V
DD
+
2OUT
2IN −
2IN +
1OUT
1IN −
1IN+
GND
1SHDN
1
2
3
4
5
10
9
8
7
6
V
DD
2OUT
2IN −
2IN+
2SHDN
TLV2773
D OR N PACKAGE
(TOP VIEW)
TLV2774
D, N, OR PW PACKAGE
(TOP VIEW)
TLV2775
D, N, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN −
1IN+
GND
NC
1SHDN
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
2OUT
2IN −
2IN+
NC
2SHDN
NC
1OUT
1IN −
1IN+
V
DD
2IN+
2IN −
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN −
4IN+
GND
3IN+
3IN −
3OUT
1OUT
1IN −
1IN+
V
DD
2IN+
2IN −
2OUT
1/2SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4OUT
4IN −
4IN+
GND
3IN +
3IN−
3OUT
3/4SHDN
† This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
(1) SOT−23 may or may not be indicated
TYPICAL PIN 1 INDICATORS
Pin 1
Printed or
Molded Dot
Pin 1
Stripe
Pin 1
Bevel Edges
Pin 1
Molded ”U” Shape
4
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