Datasheet> 器件分类 > 存储> 存储> BR93A56F-WE1

文档预览

BR93A56F-WE1: 产品描述EEPROM, 128X16, Serial, CMOS, PDSO8; 产品类别存储存储; 文件大小254KB，共6页; 制造商ROHM(罗姆半导体); 官网地址https://www.rohm.com/; 标准

下载文档详细参数选型对比全文预览

BR93A56F-WE1概述

EEPROM, 128X16, Serial, CMOS, PDSO8

BR93A56F-WE1规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	ROHM(罗姆半导体)
包装说明	SOP, SOP8,.25
Reach Compliance Code	compliant
数据保留时间-最小值	40
耐久性	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e3
内存密度	2048 bit
内存集成电路类型	EEPROM
内存宽度	16
湿度敏感等级	1
端子数量	8
字数	128 words
字数代码	128
最高工作温度	105 °C
最低工作温度	-40 °C
组织	128X16
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	225
电源	3/5 V
认证状态	Not Qualified
串行总线类型	MICROWIRE
最大待机电流	0.000002 A
最大压摆率	0.0045 mA
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	MATTE TIN
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
写保护	SOFTWARE
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

Appendix

Notes

No technical content pages of this document may be reproduced in any form or transmitted by any

means without prior permission of ROHM CO.,LTD.

The contents described herein are subject to change without notice. The specifications for the

product described in this document are for reference only. Upon actual use, therefore, please request

that specifications to be separately delivered.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard

use and operation. Please pay careful attention to the peripheral conditions when designing circuits

and deciding upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams information, described herein

are intended only as illustrations of such devices and not as the specifications for such devices. ROHM

CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any

third party's intellectual property rights or other proprietary rights, and further, assumes no liability of

whatsoever nature in the event of any such infringement, or arising from or connected with or related

to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or

otherwise dispose of the same, no express or implied right or license to practice or commercially

exploit any intellectual property rights or other proprietary rights owned or controlled by

ROHM CO., LTD. is granted to any such buyer.

Products listed in this document are no antiradiation design.

The products listed in this document are designed to be used with ordinary electronic equipment or devices

(such as audio visual equipment, office-automation equipment, communications devices, electrical

appliances and electronic toys).

Should you intend to use these products with equipment or devices which require an extremely high level of

reliability and the malfunction of with would directly endanger human life (such as medical instruments,

transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other

safety devices), please be sure to consult with our sales representative in advance.

About Export Control Order in Japan

Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control

Order in Japan.

In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)

on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.

Appendix1-Rev1.1

BR93A56F-WE1相似产品对比

	BR93A56F-WE1	BR93A56FJ-WE1
描述	EEPROM, 128X16, Serial, CMOS, PDSO8	EEPROM, 128X16, Serial, CMOS, PDSO8
是否无铅	不含铅	不含铅
是否Rohs认证	符合	符合
厂商名称	ROHM(罗姆半导体)	ROHM(罗姆半导体)
包装说明	SOP, SOP8,.25	SOP, SOP8,.25
Reach Compliance Code	compliant	compliant
数据保留时间-最小值	40	40
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e3	e3
内存密度	2048 bit	2048 bit
内存集成电路类型	EEPROM	EEPROM
内存宽度	16	16
湿度敏感等级	1	1
端子数量	8	8
字数	128 words	128 words
字数代码	128	128
最高工作温度	105 °C	105 °C
最低工作温度	-40 °C	-40 °C
组织	128X16	128X16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP
封装等效代码	SOP8,.25	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL
峰值回流温度（摄氏度）	225	225
电源	3/5 V	3/5 V
认证状态	Not Qualified	Not Qualified
串行总线类型	MICROWIRE	MICROWIRE
最大待机电流	0.000002 A	0.000002 A
最大压摆率	0.0045 mA	0.0045 mA
表面贴装	YES	YES
技术	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL
端子面层	MATTE TIN	MATTE TIN
端子形式	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm
端子位置	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED
写保护	SOFTWARE	SOFTWARE
Base Number Matches	1	1

BR93A56F-WE1

BR93A56F-WE1概述

BR93A56F-WE1规格参数

文档预览

BR93A56F-WE1相似产品对比

推荐资源