23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
SML0603-R1K-TR
Super Red
0603 Profile Surface Mount LEDs
1.6×0.8×0.8mm
120° viewing angle
DWG BY:
BL / JG
11-08-06
CHK BY:
PL
11-17-06
QA:
__
__-__-__
MFG:
__
__-__-__
REVISION LTR: -
11-08-06
Part No.
SML0603-R1K-TR
DWG NO.
DSTR0178
Page
1 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
Features:
•
•
•
•
•
1.6x0.8x0.8mm(0603) standard package.
Suitable for all SMT assembly methods.
Compatible with infrared and vapor phase reflow solder processes.
Compatible with automatic placement equipment.
This product does not contain restricted substances, complies with ROHS standards.
Applications:
•
•
•
•
Automotive : Dashboards, stop lamps, turn signals.
Backlighting : LCDs, key pads, advertising.
Status indicators : Comsumer and industrial electronics.
General use.
Package Dimensions:
Part No.
SML0603-R1K-TR
Chip Material
InGaAIP
Lens Color
Water Clear
Emission Color
Super Orange Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004” unless otherwise noted.
)
3. Specifications are subject to change without notice.
Part No.
SML0603-R1K-TR
DWG NO.
DSTR0178
Page
2 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
Electrical and optical characteristics (Ta=25°C)
Parameter
Forward Voltage
Luminous Intensity
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Viewing Angle*
Radiant Intensity
Chromaticity Coordinates
∆
2
θ
1/2
Ie
Symbol
V
F
Iv
p
d
Condition
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Min.
-
28
-
620
-
-
-
-
-
Typ.
2.0
50
640
626
18
120
-
0.72
0.29
Max.
2.6
-
-
630
-
-
-
-
-
Unit
V
mcd
nm
nm
nm
deg
µW/sr
X
Y
* Viewing angle is the Off-axis at which the luminous intensity is half the axial intensity.
Absolute Maximum Ratings (Ta=25°C)
Reverse Voltage
Reverse Current (VR=5V)
Continuous Forward Current
Peak Forward Current
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
V
R
I
R
If
I
fp
P
d
T
opr
T
stg
T
sol
5V
100
µ
A
30mA
100mA
100mW
-25°C ~ 80°C
-30°C ~ 85°C
see Solder Instruction page
1/10 duty cycle, 0.1ms Pulse Width
Typical Electro-Optical Characteristics Curves
Fig.1 Relative intensity vs. wavelength
1.0
60
Fig.2 Forward current derating curve
vs. ambient temperature
50
Fig.3 Forward current vs. forward voltage
50
40
Relative radiant intensity
Forward current (mA)
40
Forward current (mA)
30
0.5
30
20
20
10
0
0
10
580
630
680
20
40
60
80
100
0
1
2
3
4
5
Wavelength (nm)
Ambient temperature Ta( C)
Forward voltage(V)
Fig.4 Relative luminous intensity vs.
ambient temperature
3.0
4.0
Fig.5 Relative luminous intensity
vs. forward current
Fig.6 Radiation diagram
0
10
20
30
2.5
Relative Luminous intensity
(Normalized @20mA)
Relative luminous intensity (@20mA)
3.0
Relative radiant intensity
2.0
40
1.0
0.9
0.8
50
60
70
0.7
80
90
1.5
2.0
1.0
1.0
0.5
0
-40
-20
0
20
40
60
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Ambient temperature Ta( C)
Forward current (mA)
Part No.
SML0603-R1K-TR
DWG NO.
DSTR0178
Page
3 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
Tape and reel packaging specifications (Units: mm)
●
Bin Limits
Intensity Bin Limits (At 20mA)
BIN CODE
M
N
P
Q
Min. (mcd)
24.0
37.0
55.0
82.0
Max. (mcd)
48.0
72.0
11 0 . 0
160.0
●
B IN:
x
Intensity BIN CODE
Part No.
SML0603-R1K-TR
DWG NO.
DSTR0178
Page
4 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
RELIABILITY TEST
Classification
Test Item
Operation
Life
High Temperature,
High Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Temperature
Cycling
Reference Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
MIL-STD-202: 103B
JIS C 7021: B-11
MIL-STD-202: 1008
JIS C 7021: B-10
JIS C 7021:
B-12
Test Conditions
Connect with a power
Ι
= 20mAf
T a = Under room temperature
Test time = 1,000hrs
T a = +65°C±5°C
RH = 90%-95%
Test time = 240hrs
High T a = +85°C±5°C
Test time = 1,000hrs
Low T a = -35°C±5°C
Test time = 1,000hrs
-35°C ~ +25°C ~ +85°C ~ +25°C
60min. 20min. 60min. 20min.
Test time = 5 cycles
-35°C±5°C ~ +85°C±5°C
20min.
20min.
Test time = 10 cycles
Preheating:
140°C - 160°C, within 2 minutes.
Operation heating:
235°C (Max.), within 10 seconds. (Max.)
Judgment criteria for failure
Over Ux1.2
Over Ux2
Below Sx0.5
Result
0/20
Endurance
Test
0/20
0/20
0/20
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1010
JIS C 7021: A-4
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 201A
MIL-STD-750: 2031
JIS C 7021: A-1
0/20
Environmental
Test
Thermal Shock
0/20
Solder Resistance
0/20
JUDGEMENT CRITERIA OF FAILURE FOR THE RELIABILITY TEST
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
Vf (V)
Ι
r (uA)
Ι
v (mcd)
Measuring conditions
Ι
f = 20mA
Vr = 5V
Ι
f = 20mA
Note: 1. U means the upper limit of specific characteristics. S means initial value.
2. Measurement shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
1. Soldering
Manual of Soldering
The temperature of the iron tip should not be higher than 300°C (572°F) and soldering within 3 seconds per solder-land is to be observed.
Reflow Soldering
Preheating: 140°C~160°C ±5°C, within 2 minutes.
Operation heating: 235°C (Max.) within 10
seconds. (Max.)
Gradual Cooling (Avoid quenching).
235°C
140~160°C
Over 2 min.
4°C/sec.
Max.
4°C/sec. Max.
10 sec.
Max.
←
Temperature
DIP Soldering (Wave Soldering)
Preheating: 120°C~150°C, within 120~180 sec.
Operation heating: 245°C ±5°C within 5 sec.
260°C (Max.)
Gradual Cooling (Avoid quenching).
Soldering heat
Max. 260°C
120°~150°C
Preheat
120~180 sec.
245±5°C
within
5 sec.
←
Temperature
Time
→
Time
→
2. Handling
Care must be taken not to cause damage to the epoxy resin portion of LEDs while it is exposed to high temperatures, or abrade the epoxy
resin portion of LEDs with hard or sharp items as from sand blasting and the use of sharp metallic objects.
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution
should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive
care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as to be subjected to
reverse voltage when turning off the LEDs.
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.
If the envelope is still packed, store it in the following environment:
(1) Temperature: 5°C-30°C (41°F-86°F) Humidity: RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH
(3) Devices require baking before mounting if: (2)a or (2)b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60°C ±3°C
3. Notes for designing
4. Storage:
Part No.
SML0603-R1K-TR
DWG NO.
DSTR0178
Page
5 of 6
PCB设计
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