Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CQCC28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | S-XQCC-N28 |
| JESD-609代码 | e0 |
| 最大I（ol） | 0.032 A |
| 位数 | 9 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 13 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 6 |
| 翻译 | N/A |
| Base Number Matches | 1 |
| IDT54FCT863AL | IDT54FCT863AD | IDT54FCT863AE | IDT54FCT863BD | IDT54FCT863BE | IDT54FCT863BL | IDT74FCT863BPQ | IDT74FCT863APQ | 54FCT863AE | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CQCC28 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CDIP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CDFP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CDIP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CDFP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CQCC28 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, PDIP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, PDIP24 | Bus Driver/Transceiver, 1-Func, 9-Bit, True Output, CMOS, CDFP24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | S-XQCC-N28 | R-XDIP-T24 | R-XDFP-F24 | R-XDIP-T24 | R-XDFP-F24 | S-XQCC-N28 | R-PDIP-T24 | R-PDIP-T24 | R-XDFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.048 A | 0.048 A | 0.032 A |
| 位数 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | QCCN | DIP | DFP | DIP | DFP | QCCN | DIP | DIP | DFP |
| 封装等效代码 | LCC28,.45SQ | DIP24,.3 | FL24,.4 | DIP24,.3 | FL24,.4 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | FL24,.4 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 225 | 225 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 13 ns | 13 ns | 13 ns | 9 ns | 9 ns | 9 ns | 8 ns | 12 ns | 13 ns |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 6 | 6 | 6 | 6 | 6 | 6 | 30 | 30 | 6 |
| 翻译 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
模拟与混合信号
DSP 与 ARM 处理器
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微控制器 MCU
嵌入式系统
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