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Product Name
Series
Type
Part Number
Chip Beads Array
MZA Series
2010 Type
MZA2010F330CT000
PROD
Product Lifecycle Stage
Specification
Mounting Method Flag
Processing
Shape
Number of Circuits
Material Code
Size Code
Body Length(L)
Body Breadth(W)
Body Height(T)
Impedance
Impedance
Impedance Tolerance
Frequency of Impedance
Rated Voltage
Rated Current
DC Resistance
Insulation Resistance
Soldering Method
Category Temperature
Range
Storage Temperature Range
Weight
Min
Max
Min
Max
Nom
Nom
Nom
Nom
Min
Nom
Min
Max
Nom
Max
Max
Max
Min
Nom
F
2010
2m m
1m m
0.5 m m
24.75 Ohm
33 Ohm
-25 %
25 %
100 M Hz
5 V
0.1 A
0.6 Ohm
10 M Ohm
Reflow,Iron Soldering
-55 Cel
125 Cel
-55 Cel
125 Cel
0.005 g
Yes
MULTI-LAYER
Chip-Array
4
Summary/Applications/Feature
The MZA series provide effective EMC
suppression in signal lines through simple in-
series implementation. 4lines array component.
It is applicable for lead free soldering.
The MZA series provide effective EMC
suppression in signal lines through simple in-
series implementation.
4lines array component.
It is applicable for lead free soldering.
Summary
Applications PC,DVD,CDMA,LCD,PDC
Feature
Packaging
Packing
Minumum Package Qty Nom
Minimum Order Qty
Nom
Punched (Paper)Taping
[180mm Reel]
5000 Pcs
5000 Pcs
[ Caution ]
Specifications which provide more details for the proper
and safe use of the described product are available upon request.
[ Notice of Revision and Improve ]
All specifications are subject to change without notice.
Copyright(c) 1996-2008 All rights reserved.
http://roots.tdk.co.jp/rootsme.asp?ID=TJA102&NO=MZA2010F330CT000&R... 3/27/2009
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