IC 8-BIT, MROM, MICROCONTROLLER, PDIP20, PLASTIC, DIP-20, Microcontroller
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 具有ADC | NO |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | COP800 |
| 最大时钟频率 | 10 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 26.075 mm |
| I/O 线路数量 | 16 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 64 |
| ROM(单词) | 1024 |
| ROM可编程性 | MROM |
| 座面最大高度 | 5.08 mm |
| 速度 | 1 MHz |
| 最大压摆率 | 6 mA |
| 最大供电电压 | 6 V |
| 最小供电电压 | 2.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| COP822CJ-XXX/N | COP820CJ-XXX/N | COP822CJ-XXX/WM | COP820CJ-XXX/WM | COP840CJ-XXX/M | COP840CJ-XXX/N | COP842CJ-XXX/M | COP842CJ-XXX/N | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 8-BIT, MROM, MICROCONTROLLER, PDIP20, PLASTIC, DIP-20, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDSO20, SOIC-20, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDSO28, PLASTIC, SOIC-28, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDSO28, SO-28, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDIP28, DIP-28, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDSO20, SO-20, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, PDIP20, DIP-20, Microcontroller |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| 包装说明 | DIP, DIP20,.3 | DIP, DIP28,.6 | SOP, SOP20,.4 | SOP, SOP28,.4 | SOP, SOP28,.4 | DIP, DIP28,.6 | SOP, SOP20,.4 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
| 最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDIP-T20 | R-PDIP-T28 | R-PDSO-G20 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 26.075 mm | 35.725 mm | 12.8 mm | 17.9 mm | 17.9 mm | 35.725 mm | 12.8 mm | 26.075 mm |
| I/O 线路数量 | 16 | 24 | 16 | 24 | 24 | 24 | 16 | 16 |
| 端子数量 | 20 | 28 | 20 | 28 | 28 | 28 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | SOP | SOP | DIP | SOP | DIP |
| 封装等效代码 | DIP20,.3 | DIP28,.6 | SOP20,.4 | SOP28,.4 | SOP28,.4 | DIP28,.6 | SOP20,.4 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 64 | 64 | 64 | 64 | 128 | 128 | 128 | 128 |
| ROM(单词) | 1024 | 1024 | 1024 | 1024 | 2048 | 2048 | 2048 | 2048 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 5.08 mm | 5.334 mm | 2.65 mm | 2.65 mm | 2.65 mm | 5.334 mm | 2.65 mm | 5.08 mm |
| 速度 | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| 最大压摆率 | 6 mA | 6 mA | 6 mA | 6 mA | 8 mA | 8 mA | 8 mA | 8 mA |
| 最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | NO | NO | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 15.24 mm | 7.5 mm | 7.5 mm | 7.5 mm | 15.24 mm | 7.5 mm | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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