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MT47H128M8HQ-25AT: 产品描述128MX8 DDR DRAM, 0.35ns, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60; 产品类别存储存储; 文件大小9MB，共129页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

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MT47H128M8HQ-25AT概述

128MX8 DDR DRAM, 0.35ns, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60

MT47H128M8HQ-25AT规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	TFBGA,
针数	60
Reach Compliance Code	compliant
访问模式	MULTI BANK PAGE BURST
最长访问时间	0.35 ns
其他特性	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B60
JESD-609代码	e1
长度	11.5 mm
内存密度	1073741824 bit
内存集成电路类型	DDR DRAM
内存宽度	8
功能数量	1
端口数量	1
端子数量	60
字数	134217728 words
字数代码	128000000
工作模式	SYNCHRONOUS
最高工作温度	105 °C
最低工作温度	-40 °C
组织	128MX8
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.5 V
标称供电电压 (Vsup)	1.55 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	8 mm
Base Number Matches	1

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1Gb: x4, x8, x16 1.55V DDR2 SDRAM

Features

DDR2 SDRAM

MT47R256M4 – 32 Meg x 4 x 8 banks

MT47R128M8 – 16 Meg x 8 x 8 banks

MT47R64M16 – 8 Meg x 16 x 8 banks

Features

•

DDQ

= +1.55V, 1.5–1.9V range

Backward compatible with 1.8V DDR2

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

RoHS compliant

Supports JEDEC clock jitter specification

Very low power operation

Options

•

Configuration

–

256 Meg x 4 (32 Meg x 4 x 8 banks)

–

128 Meg x 8 (16 Meg x 8 x 8 banks)

–

64 Meg x 16 (8 Meg x 16 x 8 banks)

•

FBGA package (Pb-free) – x16

–

84-ball FBGA (8mm x 12.5mm) Rev. G

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 11.5mm) Rev. G

•

Timing – cycle time

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 4 (DDR2-667)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive (–40°C

≤

, T

≤

105ºC)

•

Revision

Note:

Marking

256M4

128M8

64M16

-25E

-25

-3E

-3

-37E

None

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-25E

-25

-3E

-3

-37E

CL = 3

400

CL = 4

533

667

533

CL = 5

800

667

n/a

CL = 6

800

n/a

CL = 7

n/a

(ns)

PDF: 09005aef82b91d01

1GbDDR2_1_55V.PDF Rev. A 5/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 1.55V DDR2 SDRAM

State Diagram .................................................................................................................................................. 8

Functional Description ..................................................................................................................................... 9

Industrial Temperature ................................................................................................................................ 9

Automotive Temperature ........................................................................................................................... 10

General Notes ............................................................................................................................................ 10

Functional Block Diagrams ............................................................................................................................. 11

Ball Assignments and Descriptions ................................................................................................................. 14

Packaging ...................................................................................................................................................... 18

Package Dimensions .................................................................................................................................. 18

FBGA Package Capacitance ......................................................................................................................... 21

Electrical Specifications – Absolute Ratings ..................................................................................................... 22

Temperature and Thermal Impedance ........................................................................................................ 22

Electrical Specifications – I

Parameters ........................................................................................................ 24

Specifications and Conditions ............................................................................................................... 24

DD7

Conditions .......................................................................................................................................... 25

AC Timing Operating Specifications ................................................................................................................ 29

AC and DC Operating Conditions .................................................................................................................... 38

ODT DC Electrical Characteristics ................................................................................................................... 39

Input Electrical Characteristics and Operating Conditions ............................................................................... 40

Output Electrical Characteristics and Operating Conditions ............................................................................. 43

Output Driver Characteristics ......................................................................................................................... 45

Power and Ground Clamp Characteristics ....................................................................................................... 49

AC Overshoot/Undershoot Specification ......................................................................................................... 50

Input Slew Rate Derating ................................................................................................................................ 52

Commands .................................................................................................................................................... 65

Truth Tables ............................................................................................................................................... 65

DESELECT ................................................................................................................................................. 69

NO OPERATION (NOP) .............................................................................................................................. 70

LOAD MODE (LM) ..................................................................................................................................... 70

ACTIVATE .................................................................................................................................................. 70

READ ......................................................................................................................................................... 70

WRITE ....................................................................................................................................................... 70

PRECHARGE .............................................................................................................................................. 71

REFRESH ................................................................................................................................................... 71

SELF REFRESH ........................................................................................................................................... 71

Mode Register (MR) ........................................................................................................................................ 71

Burst Length .............................................................................................................................................. 72

Burst Type ................................................................................................................................................. 73

Operating Mode ......................................................................................................................................... 73

DLL RESET ................................................................................................................................................. 73

Write Recovery ........................................................................................................................................... 74

Power-Down Mode .................................................................................................................................... 74

CAS Latency (CL) ........................................................................................................................................ 75

Extended Mode Register (EMR) ....................................................................................................................... 76

DLL Enable/Disable ................................................................................................................................... 77

Output Drive Strength ................................................................................................................................ 77

DQS# Enable/Disable ................................................................................................................................. 77

RDQS Enable/Disable ................................................................................................................................. 77

Output Enable/Disable ............................................................................................................................... 77

On-Die Termination (ODT) ........................................................................................................................ 78

Contents

PDF: 09005aef82b91d01

1GbDDR2_1_55V.PDF Rev. A 5/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 1.55V DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 78

Posted CAS Additive Latency (AL) ............................................................................................................... 78

Extended Mode Register 2 (EMR2) .................................................................................................................. 80

Extended Mode Register 3 (EMR3) .................................................................................................................. 81

Initialization .................................................................................................................................................. 82

ACTIVATE ...................................................................................................................................................... 86

READ ............................................................................................................................................................. 88

READ with Precharge ................................................................................................................................. 92

READ with Auto Precharge .......................................................................................................................... 94

WRITE ........................................................................................................................................................... 99

PRECHARGE ................................................................................................................................................. 109

REFRESH ...................................................................................................................................................... 110

SELF REFRESH .............................................................................................................................................. 111

Power-Down Mode ....................................................................................................................................... 113

Precharge Power-Down Clock Frequency Change .......................................................................................... 120

Reset ............................................................................................................................................................. 121

CKE Low Anytime ...................................................................................................................................... 121

ODT Timing .................................................................................................................................................. 123

MRS Command to ODT Update Delay ........................................................................................................ 125

PDF: 09005aef82b91d01

1GbDDR2_1_55V.PDF Rev. A 5/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 1.55V DDR2 SDRAM

Table 1: Key Timing Parameters ...................................................................................................................... 1

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 16

Table 4: Input Capacitance ............................................................................................................................ 21

Table 5: Absolute Maximum DC Ratings ........................................................................................................ 22

Table 6: Temperature Limits .......................................................................................................................... 23

Table 7: Thermal Impedance ......................................................................................................................... 23

Table 8: General I

Parameters .................................................................................................................... 24

Table 9: I

DD7

Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 25

Table 10: DDR2 I

Specifications and Conditions (Die Revision G) ................................................................ 26

Table 11: AC Operating Specifications and Conditions .................................................................................... 29

Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 38

Table 13: ODT DC Electrical Characteristics ................................................................................................... 39

Table 14: Input DC Logic Levels ..................................................................................................................... 40

Table 15: Input AC Logic Levels ..................................................................................................................... 40

Table 16: Differential Input Logic Levels ........................................................................................................ 41

Table 17: Differential AC Output Parameters .................................................................................................. 43

Table 18: Output DC Current Drive ................................................................................................................ 43

Table 19: Output Characteristics .................................................................................................................... 44

Table 20: Full Strength Pull-Down Current (mA) ............................................................................................ 45

Table 21: Full Strength Pull-Up Current (mA) ................................................................................................. 46

Table 22: Reduced Strength Pull-Down Current (mA) ..................................................................................... 47

Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 48

Table 24: Input Clamp Characteristics ........................................................................................................... 49

Table 25: Address and Control Balls ............................................................................................................... 50

Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 50

Table 27: AC Input Test Conditions ................................................................................................................ 51

Table 28: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) ................................................... 53

Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) .......................................... 54

Table 30: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ..................................................... 57

Table 31: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................ 58

Table 32: Single-Ended DQS Slew Rate Derating Values Using

and

.................................................. 59

Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ..................................... 59

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ..................................... 60

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ..................................... 60

Table 36: Truth Table – DDR2 Commands ..................................................................................................... 65

Table 37: Truth Table – Current State Bank

– Command to Bank

............................................................... 66

Table 38: Truth Table – Current State Bank

– Command to Bank

.............................................................. 68

Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 69

Table 40: Burst Definition .............................................................................................................................. 73

Table 41: READ Using Concurrent Auto Precharge ......................................................................................... 94

Table 42: WRITE Using Concurrent Auto Precharge ....................................................................................... 100

Table 43: Truth Table – CKE ......................................................................................................................... 115

List of Tables

PDF: 09005aef82b91d01

1GbDDR2_1_55V.PDF Rev. A 5/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H128M8HQ-25AT

MT47H128M8HQ-25AT概述

MT47H128M8HQ-25AT规格参数

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