DTMF Signaling Circuit, CMOS, PDIP18,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | California Micro Devices |
| 包装说明 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 端子数量 | 18 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 7 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 电信集成电路类型 | DTMF SIGNALING CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| CM8871CPI-1 | CM8872CPI-1 | CM8872CPEI-1 | CM8871CS-1 | CM8872CF-1 | CM8872CS-1 | CM8871CF-1 | CM8871CPEI-1 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DTMF Signaling Circuit, CMOS, PDIP18, | DTMF Signaling Circuit, CMOS, PDIP18, | DTMF Signaling Circuit, CMOS, PQCC20, | DTMF Signaling Circuit, CMOS, PDSO18, | DTMF Signaling Circuit, CMOS, PDSO18, | DTMF Signaling Circuit, CMOS, PDSO18, | DTMF Signaling Circuit, CMOS, PDSO18, | DTMF Signaling Circuit, CMOS, PQCC20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
| 包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | QCCJ, LDCC20,.4SQ | SOP, SOP18,.4 | SOP, SO18(UNSPEC) | SOP, SOP18,.4 | SOP, SO18(UNSPEC) | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T18 | R-PDIP-T18 | S-PQCC-J20 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | S-PQCC-J20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 18 | 18 | 20 | 18 | 18 | 18 | 18 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | SOP | SOP | SOP | SOP | QCCJ |
| 封装等效代码 | DIP18,.3 | DIP18,.3 | LDCC20,.4SQ | SOP18,.4 | SO18(UNSPEC) | SOP18,.4 | SO18(UNSPEC) | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | J BEND |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | - | 1.27 mm |
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