74AUP1G79
Low-power D-type flip-flop; positive-edge trigger
Rev. 02 — 17 October 2006
Product data sheet
1. General description
The 74AUP1G79 is a high-performance, low-power, low-voltage, Si-gate CMOS device,
superior to most advanced CMOS compatible TTL families.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial Power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74AUP1G79 provides the single positive-edge triggered D-type flip-flop. Information
on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock
pulse. The D input must be stable one setup time prior to the LOW-to-HIGH clock
transition for predictable operation.
2. Features
I
Wide supply voltage range from 0.8 V to 3.6 V
I
High noise immunity
I
Complies with JEDEC standards:
N
JESD8-12 (0.8 V to 1.3 V)
N
JESD8-11 (0.9 V to 1.65 V)
N
JESD8-7 (1.2 V to 1.95 V)
N
JESD8-5 (1.8 V to 2.7 V)
N
JESD8-B (2.7 V to 3.6 V)
I
ESD protection:
N
HBM JESD22-A114-D Class 3A exceeds 5000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101-C exceeds 1000 V
I
Low static power consumption; I
CC
= 0.9
µA
(maximum)
I
Latch-up performance exceeds 100 mA per JESD 78 Class II
I
Inputs accept voltages up to 3.6 V
I
Low noise overshoot and undershoot < 10 % of V
CC
I
I
OFF
circuitry provides partial Power-down mode operation
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
NXP Semiconductors
74AUP1G79
Low-power D-type flip-flop; positive-edge trigger
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AUP1G79GW
74AUP1G79GM
74AUP1G79GF
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
TSSOP5
XSON6
XSON6
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
Version
SOT353-1
Type number
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1
×
1.45
×
0.5 mm
plastic extremely thin small outline package; no leads; SOT891
6 terminals; body 1
×
1
×
0.5 mm
4. Marking
Table 2.
Marking
Marking code
pP
pP
pP
Type number
74AUP1G79GW
74AUP1G79GM
74AUP1G79GF
5. Functional diagram
1
D
Q
4
1
4
D
CP
mna441
2
CP
mna440
2
Fig 1. Logic symbol
Fig 2. IEC logic symbol
74AUP1G79_2
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 17 October 2006
2 of 19
NXP Semiconductors
74AUP1G79
Low-power D-type flip-flop; positive-edge trigger
CP
C
C
C
C
D
TG
C
TG
C
Q
C
C
TG
TG
C
C
mna442
Fig 3. Logic diagram
6. Pinning information
6.1 Pinning
74AUP1G79
74AUP1G79
D
CP
1
2
GND
GND
3
001aac562
D
5
V
CC
1
6
V
CC
D
CP
74AUP1G79
1
2
3
6
5
4
V
CC
n.c.
Q
CP
2
5
n.c.
3
4
Q
GND
4
Q
001aac524
001aaf179
Transparent top view
Transparent top view
Fig 4. Pin configuration SOT353-1
(TSSOP5)
Fig 5. Pin configuration SOT886
(XSON6)
Fig 6. Pin configuration SOT891
(XSON6)
6.2 Pin description
Table 3.
Symbol
D
CP
GND
Q
n.c.
V
CC
Pin description
Pin
TSSOP5
1
2
3
4
-
5
XSON6
1
2
3
4
5
6
data input D
clock pulse input CP
ground (0 V)
data output Q
not connected
supply voltage
Description
74AUP1G79_2
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 17 October 2006
3 of 19
NXP Semiconductors
74AUP1G79
Low-power D-type flip-flop; positive-edge trigger
7. Functional description
Table 4.
Input
CP
↑
↑
L
[1]
Function table
[1]
Output
D
L
H
X
Q
L
H
q
H = HIGH voltage level;
L = LOW voltage level;
↑
= LOW-to-HIGH CP transition;
X = don’t care;
q = lower case letter indicates the state of referenced input, one setup time prior to the LOW-to-HIGH CP transition.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
V
I
I
OK
V
O
I
O
I
CC
I
GND
T
stg
P
tot
[1]
[2]
Parameter
supply voltage
input clamping current
input voltage
output clamping current
output voltage
output current
supply current
ground current
storage temperature
total power dissipation
Conditions
V
I
< 0 V
[1]
Min
−0.5
-
−0.5
-
[1]
Max
+4.6
−50
+4.6
±50
+4.6
±20
50
−50
+150
250
Unit
V
mA
V
mA
V
mA
mA
mA
°C
mW
V
O
> V
CC
or V
O
< 0 V
Active mode and Power-down mode
V
O
= 0 V to V
CC
−0.5
-
-
-
−65
T
amb
=
−40 °C
to +125
°C
[2]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For TSSOP5 packages: above 87.5
°C
the value of P
tot
derates linearly with 4.0 mW/K.
For XSON6 packages: above 45
°C
the value of P
tot
derates linearly with 2.4 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
V
CC
V
I
V
O
T
amb
∆t/∆V
Recommended operating conditions
Parameter
supply voltage
input voltage
output voltage
ambient temperature
input transition rise and fall rate
V
CC
= 0.8 V to 3.6 V
Active mode
Power-down mode; V
CC
= 0 V
Conditions
Min
0.8
0
0
0
−40
0
Max
3.6
3.6
V
CC
3.6
+125
200
Unit
V
V
V
V
°C
ns/V
74AUP1G79_2
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 17 October 2006
4 of 19
NXP Semiconductors
74AUP1G79
Low-power D-type flip-flop; positive-edge trigger
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
T
amb
= 25
°C
V
IH
HIGH-level input voltage
V
CC
= 0.8 V
V
CC
= 0.9 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 3.0 V to 3.6 V
V
IL
LOW-level input voltage
V
CC
= 0.8 V
V
CC
= 0.9 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 3.0 V to 3.6 V
V
OH
HIGH-level output voltage
V
I
= V
IH
or V
IL
I
O
=
−20 µA;
V
CC
= 0.8 V to 3.6 V
I
O
=
−1.1
mA; V
CC
= 1.1 V
I
O
=
−1.7
mA; V
CC
= 1.4 V
I
O
=
−1.9
mA; V
CC
= 1.65 V
I
O
=
−2.3
mA; V
CC
= 2.3 V
I
O
=
−3.1
mA; V
CC
= 2.3 V
I
O
=
−2.7
mA; V
CC
= 3.0 V
I
O
=
−4.0
mA; V
CC
= 3.0 V
V
OL
LOW-level output voltage
V
I
= V
IH
or V
IL
I
O
= 20
µA;
V
CC
= 0.8 V to 3.6 V
I
O
= 1.1 mA; V
CC
= 1.1 V
I
O
= 1.7 mA; V
CC
= 1.4 V
I
O
= 1.9 mA; V
CC
= 1.65 V
I
O
= 2.3 mA; V
CC
= 2.3 V
I
O
= 3.1 mA; V
CC
= 2.3 V
I
O
= 2.7 mA; V
CC
= 3.0 V
I
O
= 4.0 mA; V
CC
= 3.0 V
I
I
I
OFF
∆I
OFF
I
CC
∆I
CC
C
I
C
O
input leakage current
power-off leakage current
additional power-off
leakage current
supply current
additional supply current
input capacitance
output capacitance
V
I
= GND to 3.6 V; V
CC
= 0 V to 3.6 V
V
I
or V
O
= 0 V to 3.6 V; V
CC
= 0 V
V
I
or V
O
= 0 V to 3.6 V;
V
CC
= 0 V to 0.2 V
V
I
= GND or V
CC
; I
O
= 0 A;
V
CC
= 0.8 V to 3.6 V
per pin; V
I
= V
CC
−
0.6 V; I
O
= 0 A;
V
CC
= 3.3 V
V
CC
= 0 V to 3.6 V; V
I
= GND or V
CC
V
O
= GND; V
CC
= 0 V
[1]
Conditions
Min
Typ
Max
-
-
-
-
Unit
V
V
V
V
0.70
×
V
CC
-
0.65
×
V
CC
-
1.6
2.0
-
-
-
-
V
CC
−
0.1
1.11
1.32
2.05
1.9
2.72
2.6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.8
1.7
0.30
×
V
CC
V
0.35
×
V
CC
V
0.7
0.9
-
-
-
-
-
-
-
-
0.1
0.3
×
V
CC
0.31
0.31
0.31
0.44
0.31
0.44
±0.1
±0.2
±0.2
0.5
40
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
µA
µA
µA
µA
pF
pF
0.75
×
V
CC
-
74AUP1G79_2
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 17 October 2006
5 of 19
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