1A HALF BRIDGE BASED PRPHL DRVR, PDSO8, LEAD FREE, SOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 内置保护 | THERMAL |
| 驱动器位数 | 2 |
| 接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e6 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 输出电流流向 | SOURCE AND SINK |
| 标称输出峰值电流 | 1 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.8 mm |
| 标称供电电压 | 18 V |
| 表面贴装 | YES |
| 技术 | MOS |
| 端子面层 | TIN BISMUTH |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 断开时间 | 200 µs |
| 接通时间 | 120 µs |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| UPD166101GR-E2-AZ | UPD166101GR-E1-AZ | UPD166100GR-E1-AZ | UPD166100GR-E2-AZ | |
|---|---|---|---|---|
| 描述 | 1A HALF BRIDGE BASED PRPHL DRVR, PDSO8, LEAD FREE, SOP-8 | UPD166101GR-E1-AZ | UPD166100GR-E1-AZ | 1A HALF BRIDGE BASED PRPHL DRVR, PDSO8, LEAD FREE, SOP-8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC | SOP | SOP | SOIC |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 内置保护 | THERMAL | THERMAL | THERMAL | THERMAL |
| 驱动器位数 | 2 | 2 | 2 | 2 |
| 接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e6 | e6 | e6 | e6 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
| 标称输出峰值电流 | 1 A | 1 A | 1 A | 1 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 7 V | 7 V | 7 V | 7 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.8 mm | 1.8 mm | 1.8 mm | 1.8 mm |
| 标称供电电压 | 18 V | 18 V | 18 V | 18 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | MOS | MOS | MOS | MOS |
| 端子面层 | TIN BISMUTH | Tin/Bismuth (Sn/Bi) | TIN BISMUTH | TIN BISMUTH |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 断开时间 | 200 µs | 200 µs | 200 µs | 200 µs |
| 接通时间 | 120 µs | 120 µs | 120 µs | 120 µs |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
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