D/A Converter, 1 Func, Parallel, Word Input Loading, 0.15us Settling Time, CDIP32,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Signal Processing Technologies |
| Reach Compliance Code | unknown |
| 最大模拟输出电压 | 10 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-T32 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.006% |
| 标称负供电电压 | -15 V |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP32,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 标称安定时间 (tstl) | 0.15 µs |
| 最大压摆率 | 35 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| HDAC52160BCJ | HDAC52160CCJ | HDAC52160CCU | |
|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.15us Settling Time, CDIP32, | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.15us Settling Time, CDIP32, | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.15us Settling Time, |
| Reach Compliance Code | unknown | unknown | unknown |
| 最大模拟输出电压 | 10 V | 10 V | 10 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-T32 | R-CDIP-T32 | X-XUUC-N32 |
| 最大线性误差 (EL) | 0.006% | 0.012% | 0.012% |
| 标称负供电电压 | -15 V | -15 V | -15 V |
| 位数 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 |
| 最高工作温度 | 70 °C | 70 °C | 25 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIE |
| 封装等效代码 | DIP32,.6 | DIP32,.6 | DIE OR CHIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| 封装形式 | IN-LINE | IN-LINE | UNCASED CHIP |
| 电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 标称安定时间 (tstl) | 0.15 µs | 0.15 µs | 0.15 µs |
| 最大压摆率 | 35 mA | 35 mA | 35 mA |
| 标称供电电压 | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | OTHER |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | UPPER |
| Base Number Matches | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | - |
| 厂商名称 | Signal Processing Technologies | - | Signal Processing Technologies |
| JESD-609代码 | e0 | e0 | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 2.54 mm | 2.54 mm | - |
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