To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
HD66410
(RAM-Provided 128-Channel Driver for Dot-Matrix
Graphic LCD)
Description
The HD66410 drives and controls a dot-matrix graphic LCD using a bit-mapped display method. It
provides a highly flexible display through its on-chip display RAM, in which each bit of data can be used
to turn on or off one dot on the LCD panel.
A single HD66410 can display a maximum of 128
×
33 dots using its powerful display control functions. It
features 24-channel annunciator output operating with 1/3 duty cycle that is available even during standby
modes, which makes it suitable for time and other mark indications.
An MPU can access the HD66410 at any time because the MPU operations are asynchronous with the
HD66410’s system clock and display operations.
Its low-voltage operation at minimum 2.2V and the standby function provides low power-dissipation,
making the HD66410 suitable for small portable device applications.
•
4.2-kbits (128
×
33-bit) bit-mapped display RAM
•
128
×
33 dots displayed using a single HD66410
8 characters
×
2 lines (16
×
16-dot character)
21 characters
×
4 lines (6
×
8-dot character)
•
Annunciator display using dedicated output channels
Maximum of 72 segments displayed with 1/3 duty cycle
Available even during standby modes
D
is
Features
co
nt
in
ue
1
HD66410
•
Flexible LCD driver configuration
Row output from both sides of an LCD panel
Row output from one side of an LCD panel
•
Low power-dissipation suitable for long battery-based operation
Voltage operation: 2.2 to 5.5V
Two standby modes: modes with and without annunciator display
•
On-chip double to quadruple booster
•
Versatile display control functions
Display data read/write
Display on/off
Blink area select
Read-modify-write
•
80-system MPU interface through 8-bit asynchronous data bus
•
On-chip oscillator combined with external resistor and capacitor
•
Tape carrier package (TCP)
Ordering Information
Type No.
HD66410TA0
HCD66410BP
Package
2
D
is
co
Chip with gold bump
Outer Lead Pitch 300
µm
(TCP-239)
nt
in
ue
Column address inversion according to column driver layout
Vertical display scroll
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
