Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IBM |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, TSOP44/50,.46,32 |
针数 | 50 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 20.95 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 44 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP44/50,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
最大待机电流 | 0.0002 A |
最大压摆率 | 0.065 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
IBM0116160PT3-70 | IBM0116160J3-70 | IBM0116160MT3-70 | IBM0116160PJ3-70 | IBM0116160BJ3-70 | IBM0116160BT3-70 | IBM0116160MJ3-70 | IBM0116160T3-70 | |
---|---|---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 | Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP2 | SOJ | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | TSOP2 |
包装说明 | TSOP2, TSOP44/50,.46,32 | SOJ, SOJ42,.44 | TSOP2, TSOP44/50,.46,32 | SOJ, SOJ42,.44 | SOJ, SOJ42,.44 | TSOP2, TSOP44/50,.46,32 | SOJ, SOJ42,.44 | TSOP2, TSOP44/50,.46,32 |
针数 | 50 | 42 | 50 | 42 | 42 | 50 | 42 | 50 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-J42 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-G44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 20.95 mm | 27.31 mm | 20.95 mm | 27.31 mm | 27.31 mm | 20.95 mm | 27.31 mm | 20.95 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 42 | 44 | 42 | 42 | 44 | 42 | 44 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | TSOP2 |
封装等效代码 | TSOP44/50,.46,32 | SOJ42,.44 | TSOP44/50,.46,32 | SOJ42,.44 | SOJ42,.44 | TSOP44/50,.46,32 | SOJ42,.44 | TSOP44/50,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 5 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
座面最大高度 | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm | 3.76 mm | 1.2 mm | 3.76 mm | 1.2 mm |
自我刷新 | YES | NO | YES | YES | NO | NO | YES | NO |
最大待机电流 | 0.0002 A | 0.001 A | 0.0002 A | 0.0002 A | 0.001 A | 0.001 A | 0.0002 A | 0.001 A |
最大压摆率 | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA |
最大供电电压 (Vsup) | 3.6 V | 5.5 V | 5.5 V | 3.6 V | 3.6 V | 3.6 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 3 V | 4.5 V | 4.5 V | 3 V | 3 V | 3 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 3.3 V | 5 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | J BEND | GULL WING | J BEND | J BEND | GULL WING | J BEND | GULL WING |
端子节距 | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | IBM | - | IBM | IBM | IBM | IBM | IBM | IBM |
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