|
ADS8254IRGCR |
ADS8254IBRGCT |
ADS8254IBRGCR |
ADS8254IRGCT |
描述 |
16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 |
16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 |
16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 |
16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
QFN |
QFN |
QFN |
QFN |
包装说明 |
VQFN-64 |
HVQCCN, LCC64,.35SQ,20 |
HVQCCN, LCC64,.35SQ,20 |
HVQCCN, LCC64,.35SQ,20 |
针数 |
64 |
64 |
64 |
64 |
Reach Compliance Code |
compliant |
compli |
compli |
compli |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
最大模拟输入电压 |
4.096 V |
- |
4.096 V |
4.096 V |
最小模拟输入电压 |
-4.096 V |
- |
-4.096 V |
-4.096 V |
最长转换时间 |
0.65 µs |
- |
0.65 µs |
0.65 µs |
转换器类型 |
ADC, SUCCESSIVE APPROXIMATION |
- |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 |
S-PQCC-N64 |
- |
S-PQCC-N64 |
S-PQCC-N64 |
JESD-609代码 |
e4 |
- |
e4 |
e4 |
长度 |
9 mm |
- |
9 mm |
9 mm |
最大线性误差 (EL) |
0.0023% |
- |
0.0011% |
0.0023% |
湿度敏感等级 |
3 |
- |
3 |
3 |
标称负供电电压 |
-5 V |
- |
-5 V |
-5 V |
模拟输入通道数量 |
4 |
- |
4 |
4 |
位数 |
16 |
- |
16 |
16 |
功能数量 |
1 |
- |
1 |
1 |
端子数量 |
64 |
- |
64 |
64 |
最高工作温度 |
85 °C |
- |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
- |
-40 °C |
-40 °C |
输出位码 |
BINARY |
- |
BINARY |
BINARY |
输出格式 |
PARALLEL, WORD |
- |
PARALLEL, WORD |
PARALLEL, WORD |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
HVQCCN |
- |
HVQCCN |
HVQCCN |
封装等效代码 |
LCC64,.35SQ,20 |
- |
LCC64,.35SQ,20 |
LCC64,.35SQ,20 |
封装形状 |
SQUARE |
- |
SQUARE |
SQUARE |
封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
260 |
- |
260 |
260 |
电源 |
+-5,3/5 V |
- |
+-5,3/5 V |
+-5,3/5 V |
认证状态 |
Not Qualified |
- |
Not Qualified |
Not Qualified |
采样速率 |
1 MHz |
- |
1 MHz |
1 MHz |
采样并保持/跟踪并保持 |
SAMPLE |
- |
SAMPLE |
SAMPLE |
座面最大高度 |
1 mm |
- |
1 mm |
1 mm |
最大压摆率 |
50 mA |
- |
50 mA |
50 mA |
标称供电电压 |
5 V |
- |
5 V |
5 V |
表面贴装 |
YES |
- |
YES |
YES |
温度等级 |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
- |
NO LEAD |
NO LEAD |
端子节距 |
0.5 mm |
- |
0.5 mm |
0.5 mm |
端子位置 |
QUAD |
- |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
9 mm |
- |
9 mm |
9 mm |