Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | NIBBLE |
| 最长访问时间 | 100 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-PDIP-T18 |
| 长度 | 22.6 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | NIBBLE MODE DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 18 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 4.7 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MSM511001A-10RS | MSM511001A-80JS | MSM511001A-10ZS | MSM511001A-70JS | MSM511001A-80RS | MSM511001A-80ZS | MSM511001A-10JS | MSM511001A-70ZS | MSM511001A-70RS | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 |
| 厂商名称 | OKI | OKI | OKI | OKI | OKI | OKI | OKI | OKI | OKI |
| 零件包装代码 | DIP | SOJ | ZIP | SOJ | DIP | ZIP | SOJ | ZIP | DIP |
| 包装说明 | DIP, | SOJ, | ZIP, | SOJ, | DIP, | ZIP, | SOJ, | ZIP, | DIP, |
| 针数 | 18 | 20 | 20 | 20 | 18 | 20 | 20 | 20 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE |
| 最长访问时间 | 100 ns | 80 ns | 100 ns | 70 ns | 80 ns | 80 ns | 100 ns | 70 ns | 70 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-J20 | R-PZIP-T19 | R-PDSO-J20 | R-PDIP-T18 | R-PZIP-T19 | R-PDSO-J20 | R-PZIP-T19 | R-PDIP-T18 |
| 长度 | 22.6 mm | 17.15 mm | 25.5 mm | 17.15 mm | 22.6 mm | 25.5 mm | 17.15 mm | 25.5 mm | 22.6 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 20 | 19 | 20 | 18 | 19 | 20 | 19 | 18 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOJ | ZIP | SOJ | DIP | ZIP | SOJ | ZIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 4.7 mm | 3.65 mm | 10.16 mm | 3.65 mm | 4.7 mm | 10.16 mm | 3.65 mm | 10.16 mm | 4.7 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 2.8 mm | 7.62 mm | 7.62 mm | 2.8 mm | 7.62 mm | 2.8 mm | 7.62 mm |
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