.
Model: FXO-HC32 SERIES
HCMOS 3.2 x 2.5mm 2.5V Oscillator
Features
X
TREMELY
Low Jitter
Low Cost
X
PRESS
Delivery
Frequency Resolution to six decimal places
Stabilities to ± 25 PPM
-20 to +70°C or -40 to +85°C operating temperatures
Tri-State Enable / Disable Feature
Industry Standard Package, Footprint & Pin-Out
Fully RoHS and REACH compliant
Gold over Nickel Termination Finish
Serial ID with Comprehensive Traceability
V
DD
Enable / Disable
Freq: 0.75 MHz to 180MHz
Rev.3/27/2012
Applications
ANY application requiring an oscillator
SONET
Ethernet
Storage Area Network
Broadband Access
Microprocessors / DSP / FPGA
Industrial Controllers
Test and Measurement Equipment
Fiber Channel
X
PRESS
O
ASICs
GND
FOX
OUTPUT
For more information -- Click on the drawing
Contents
Description
The Fox X
PRESS
O Crystal Oscillator is a
breakthrough in configurable Frequency Control
Solutions. X
PRESS
O utilizes a family of
proprietary ASICs, designed and developed by
Fox, with a key focus on noise reduction
technologies.
The 3
rd
order Delta Sigma Modulator reduces
noise to the levels that are comparable to
traditional Bulk Quartz and SAW oscillators.
The ASICs family has ability to select the output
type, input voltages, and temperature
performance features.
With the X
PRESS
lead-time, low cost, low noise,
wide frequency range, excellent ambient
performance, XpressO is an excellent choice
over the conventional technologies.
Finished X
PRESS
O parts are 100% final tested.
FOXElectronics
5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 http://www.foxonline.com
EMEA
Tel/Fax: +44 .1767.312632 |
Asia
Hong Kong Tel: +852.2854.4285 Fax +852.2854.4282
Taiwan
Tel: +886.2.22073427 Fax +886.2.22073486 |
Japan
Tel: +81.3.3374.2079 Fax: +81.3.3374.5221
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
DWG-5053
page
Model Selection & Part Number Guide
2
Electrical Characteristics
3
Absolute Maximums
4
Output Wave Characteristics
4
Phase Noise
5
Jitter
5
Pin Assignment
6
Recommended Circuit
6
Reflow
6
Mechanical Drawing and Pad Layout
7
Tape and Reel Specification
8
Label
8
Traceability – LOT Number & Serial Identification 9
SGS Report
10~13
REACH Report
14~21
Mechanical Test
22
Burn-In Test
22
MTTF / FITS calculations
23
Other X
PRESS
O Links
24
Fox Contact Information
24
Page 1 of 24
FXO-HC32
Series
Model Selection Guide & Fox Part Number
STEP #1:
Customer selects the Model Description and provides to Fox Customer Service
Model Description
FXO – H C 3 2 5 R – 106.25
Frequency (in MHz)
Resolutions to 6 places
past the decimal point
C
= Ceramic
H
= HCMOS
Q
= Quartz
L
= LVDS
P
= LVPECL
M
=
LVDS
(pin 2 E/D)
Q
= LVPECL
(pin 2 E/D)
X
= HCMOS
(comp 2
nd
Output)
3 = 3.2 x 2.5mm
5
= 5 x 3.2mm
7
= 7 x 5mm
3
= 3.3 V
2
= 2.5 V
0
= ± 100 PPM
blank
= -20°C to +70°C
5
= ± 50 PPM
R
= -40°C to +85°C
6
= ± 25 PPM
(-20 ~ +70°C)
STEP #2:
The Fox Customer Service team provides a customer specific Part Number
for use on their Bill Of Materials (BOM).
Fox Part Number
The 1
st
Field
Product Code #
766A = FXO–HC32
766
= FXO–HC33
(The assigned Fox Part Number must be on the BOM – not the above Model Description)
(This will ensure receipt of the proper part)
766A – 1 0 6
.
2 5 – 8
The 3
rd
Field
Fox Internally Generated Number
(If any specification changes,
the last digits change)
(The same specs for a different customer
also changes the last digits)
The 2
nd
Field
The Customer’s Frequency
This example,
FXO-HC325R-106.25
= HCMOS Output, Ceramic 3.2 x 2.5mm Package, 2.5V,
±50 PPM Stability, -40 to +85°C Temperature Range, at 106.25 MHz
Page
2 of 24
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
DWG-5053
FXO-HC32
Series
Electrical Characteristics
Parameters
Frequency Range
Frequency Stability
1
Temperature Range
Supply Voltage
T
O
T
STG
V
DD
Symbol
F
O
Condition
-20 ~ +70°C
-40 to +85°C
Standard operating
Optional operating
Storage
Standard
0.75 ~ 20 MHz
20+ ~ 50 MHz
50+ ~ 100 MHz
100+ ~ 130 MHz
130+ ~ 160 MHz
160+ ~ 180 MHz
Standard
Maximum Value
(unless otherwise noted)
Input Current
(@ 15pF LOAD)
I
DD
Output Load
Start-Up Time
Output Enable / Disable Time
Moisture Sensitivity Level
Termination Finish
1
HCMOS
T
S
MSL
JEDEC J-STD-20
0.750 to 180.000 MHz
100, 50, 25* PPM
100, 50 PPM
-20°C to +70°C
-40°C to +85°C
-55°C to +125°C
2.5 V ± 5%
22 mA
25 mA
29 mA
32 mA
35 mA
37 mA
15 pF
10 mS
100 nS
1
Au
*Excludes aging.
I
nclusive of 25°C tolerance, operating temperature range, input voltage change, load change, aging, shock and vibration.
Absolute Maximum Ratings
(Useful life may be impaired. For user guidelines only, not tested)
Operation is only guaranteed for voltage and temperature specifications in Electrical Characteristics section.)
Parameters
Input Voltage
Operating Temperature
Storage Temperature
Junction Temperature
ESD Sensitivity
Symbol
V
DD
T
AMAX
T
STG
HBM
Condition
Maximum Value
(unless otherwise noted)
Human Body Model
–0.5V to +5.0V
–55°C to +105°C
–55°C to +125°C
150°C
> 1 kV
Page
3 of 24
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
DWG-5053
FXO-HC32
Series
Output Wave Characteristics
Parameters
Output LOW Voltage
Output HIGH Voltage
Output Symmetry
(See Drawing Below)
Output Enable
(PIN # 1)
Voltage
Output Disable
(PIN # 1)
Voltage
Cycle Rise Time
(See Drawing Below)
Cycle Fall Time
(See Drawing Below)
V
IH
V
IL
T
R
T
F
0.75 to 160 MHz
160+ to 180 MHz
0.75 to 160 MHz
160+ to 180 MHz
Symbol
V
OL
V
OH
Condition
0.75 to 160 MHz
160+ to 180 MHz
0.75 to 160 MHz
160+ to 180 MHz
@ 50% V
DD
Level
Maximum Value
(unless otherwise noted)
10% V
DD
20% V
DD
90% V
DD
MIN
80% V
DD
MIN
45% ~ 55%
≥
70% V
DD
≤
30% V
DD
3.5 nS
(10%~90%)
2.5 nS
(20%~80%)
3.5 nS
(90%~10%)
2.5 nS
(80%~20%)
If 30% to 70% times are used, Rise and Fall times change to 2 nS from 0.75 to 180MHz
If 20% to 80% times are used, Rise and Fall times change to 2.5 nS from 0.75 to 160MHz
Rise Time / Fall Time Measurements
10% to 90%
0V to V
DD
20% to 80%
30% to 70%
10% - 90%
Rise Time
On Time
1/2 Period
90% - 10%
Fall Time
80 - 20
Times
70 - 30
Times
Oscillator Symmetry
Off Time
1/2 Period
50% V
DD
Period
Ideally, Symmetry should be 50/50 -- Other expressions are 45/55 or 55/45
Page
4 of 24
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
DWG-5053
FXO-HC32
Series
Phase Noise
0
2.5V Phase Noise Graphs
(dBc/Hz vs. offset frequency
-20
Data Collected using HP 3048A
Four Frequencies from Jitter Tables
62.5MHz only to 2MHz offset due to Equipment Limitation
-40
156.25MHz
-60
106.25MHz
dBc
-80
-100
125MHz
-120
62.5MHz
-140
-160
10
100
1000
10000
100000
1000000
10000000
100000000
Jitter is frequency dependent. Below are typical values at select frequencies.
Phase Jitter & Time Interval Error (TIE)
Frequency
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
Phase Jitter
(12kHz to 20MHz)
TIE
(Sigma of Jitter Distribution)
Units
pS RMS
pS RMS
pS RMS
pS RMS
0.9
0.8
0.8
0.9
2.9
3.5
2.5
3.1
Phase Jitter
is integrated from HP3048 Phase Noise Measurement System; measured directly into 50 ohm input; V
DD
= 2.5V.
TIE
was measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software; V
DD
= 2.5V.
Per
MJSQ
spec (Methodologies for Jitter and Signal Quality specifications)
Random & Deterministic Jitter Composition
Frequency
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
Random (Rj)
(pS RMS)
Deterministic (Dj)
(pS P-P)
Total Jitter (Tj)
(14 x Rj) + Dj
28.4 pS
27.2 pS
27.7 pS
30.3 pS
1.3
1.3
1.3
1.4
9.2
9.0
8.8
10.4
Rj and Dj
, measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software.Per
MJSQ
spec
(Methodologies for Jitter and Signal Quality specifications)
Page
5 of 24
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
DWG-5053
FPGA/CPLD
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