Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | MODULE |
| 包装说明 | DIMM, DIMM144,32 |
| 针数 | 144 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST |
| 最长访问时间 | 5.4 ns |
| 其他特性 | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 133 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDMA-N144 |
| 内存密度 | 1073741824 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 144 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16MX64 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装等效代码 | DIMM144,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 8192 |
| 自我刷新 | YES |
| 最大待机电流 | 0.008 A |
| 最大压摆率 | 0.88 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| M464S1654CTS-C7C | M464S1654CTS-C7A | 16-DAJD-A25-XX | M464S1654CTS-C1H | M464S1654CTS-L1L | M464S1654CTS-L1H | M464S1654CTS-L7C | M464S1654CTS-C1L | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | MINIATURE ROTARY SWITCH | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | MODULE | MODULE | - | MODULE | MODULE | MODULE | MODULE | MODULE |
| 包装说明 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | - | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 |
| 针数 | 144 | 144 | - | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compli | compli |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
| 最长访问时间 | 5.4 ns | 5.4 ns | - | 6 ns | 6 ns | 6 ns | 5.4 ns | 6 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 133 MHz | 133 MHz | - | 100 MHz | 100 MHz | 100 MHz | 133 MHz | 100 MHz |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDMA-N144 | R-XDMA-N144 | - | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
| 内存密度 | 1073741824 bit | 1073741824 bit | - | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bi | 1073741824 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 | 64 | - | 64 | 64 | 64 | 64 | 64 |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 144 | 144 | - | 144 | 144 | 144 | 144 | 144 |
| 字数 | 16777216 words | 16777216 words | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | - | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16MX64 | 16MX64 | - | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | - | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装等效代码 | DIMM144,32 | DIMM144,32 | - | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 225 | 225 | - | 225 | 225 | 225 | 225 | 225 |
| 电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 8192 | 8192 | - | 8192 | 8192 | 8192 | 8192 | 8192 |
| 自我刷新 | YES | YES | - | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 最大压摆率 | 0.88 mA | 0.8 mA | - | 0.76 mA | 0.76 mA | 0.76 mA | 0.88 mA | 0.76 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | - | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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