HY5PS121621CLFP-C4概述

DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84

HY5PS121621CLFP-C4规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	SK Hynix(海力士)
零件包装代码	BGA
包装说明	TFBGA, BGA84,9X15,32
针数	84
Reach Compliance Code	unknown
ECCN代码	EAR99
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.5 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	267 MHz
I/O 类型	COMMON
交错的突发长度	4,8
JESD-30 代码	R-PBGA-B84
JESD-609代码	e1
长度	13 mm
内存密度	536870912 bit
内存集成电路类型	DDR DRAM
内存宽度	16
功能数量	1
端口数量	1
端子数量	84
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	95 °C
最低工作温度
组织	32MX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA84,9X15,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	1.8 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	4,8
最大待机电流	0.008 A
最大压摆率	0.32 mA
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	10.5 mm
Base Number Matches	1

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HY5PS12421C(L)FP

HY5PS12821C(L)FP

HY5PS121621C(L)FP

512Mb DDR2 SDRAM

HY5PS12421C(L)FP

HY5PS12821C(L)FP

HY5PS121621C(L)FP

This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any

responsibility for use of circuits described. No patent licenses are implied.

Rev. 0.9 / Sep. 2008

HY5PS121621CLFP-C4相似产品对比

	HY5PS121621CLFP-C4	HY5PS12821CFP-Y5	HY5PS12821CLFP-S5	HY5PS12421CLFP-C4	HY5PS12821CLFP-E3	HY5PS121621CLFP-Y5	HY5PS12421CLFP-S5	HY5PS12421CFP-S5	HY5PS12421CFP-E3
描述	DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84	DDR DRAM, 64MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 64MX8, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 128MX4, 0.5ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 64MX8, 0.6ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84	DDR DRAM, 128MX4, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 128MX4, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60	DDR DRAM, 128MX4, 0.6ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA, BGA84,9X15,32	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32	TFBGA, BGA84,9X15,32	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32
针数	84	60	60	60	60	84	60	60	60
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	0.5 ns	0.45 ns	0.4 ns	0.5 ns	0.6 ns	0.45 ns	0.4 ns	0.4 ns	0.6 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	267 MHz	333 MHz	400 MHz	267 MHz	200 MHz	333 MHz	400 MHz	400 MHz	200 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
交错的突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 代码	R-PBGA-B84	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60	R-PBGA-B84	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1	e1
长度	13 mm	10.5 mm	10.5 mm	10.5 mm	10.5 mm	13 mm	10.5 mm	10.5 mm	10.5 mm
内存密度	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	16	8	8	4	8	16	4	4	4
功能数量	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1
端子数量	84	60	60	60	60	84	60	60	60
字数	33554432 words	67108864 words	67108864 words	134217728 words	67108864 words	33554432 words	134217728 words	134217728 words	134217728 words
字数代码	32000000	64000000	64000000	128000000	64000000	32000000	128000000	128000000	128000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C
组织	32MX16	64MX8	64MX8	128MX4	64MX8	32MX16	128MX4	128MX4	128MX4
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装等效代码	BGA84,9X15,32	BGA60,9X11,32	BGA60,9X11,32	BGA60,9X11,32	BGA60,9X11,32	BGA84,9X15,32	BGA60,9X11,32	BGA60,9X11,32	BGA60,9X11,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
电源	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	8192	8192	8192	8192	8192	8192	8192	8192	8192
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES	YES
连续突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
最大待机电流	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.32 mA	0.22 mA	0.23 mA	0.21 mA	0.21 mA	0.32 mA	0.23 mA	0.23 mA	0.21 mA
最大供电电压 (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	20	20	20	20	20	20	20	20	20
宽度	10.5 mm	10 mm	10 mm	10 mm	10 mm	10.5 mm	10 mm	10 mm	10 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
厂商名称	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	-	-	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)

HY5PS121621CLFP-C4

HY5PS121621CLFP-C4概述

HY5PS121621CLFP-C4规格参数

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HY5PS121621CLFP-C4相似产品对比

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