Tempus CBC 20 Connector System
ITT Industries, Cannon ...
providing a comprehensive offering of connectivity solutions.
In addition to our comprehensive offering of connector products, we provide a complete line of electronic
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Top/side actuated tacts
Low profile SMT
Navigation/scrolling switches
Long life key switches
Toggle, rocker, pushbutton, DIP,
slide, snap, switchlock, rotary, thumbwheel
SIM, full card, media and memory card configurations
Performance metal plating and inlays
Pick-and-place and IP65 compatible
“Spoon” shaped landing or friction contacts enhance
interconnect performance and minimize damage from
debris, mis-inserts and vandalism.
Rubber and In Mold Decoration (IMD) products
Wide range of cosmetic options
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Multiple PILL and contact options
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2 mm Interconnect
Contents
The Industry Standard
General Data
Electrical Data
Mechanical Data
System Overview
Female Signal Modules, Solder
Female Signal Modules, Pressfit
Female Power Modules, Solder
Female Power Modules, Pressfit
Male Signal Modules Solder
Male Signal Modules, Wide
Wall Pressfit
Male Power Modules, Wide Wall
Solder / Pressfit
Male Right-Angle Signal Modules,
Wide Wall
Female Signal Modules, Pressfit
Female Signal Modules,
Pressfit/Solder
Male Signal Modules, Solder
Male Signal Modules, Pressfit
Male Power Modules,
Pressfit/Solder
Male Right-Angle Signal Module
Male Right-Angle Power Module
Male Right-Angle Power/Signal
Combined
Female Straight Power Module
Shrouds
Hybrid Modules
Guide Pin / Socket
Cable Connectors, 4 Row
Coding System
Custom Monoblocks
Typical Futurebus+
Standard Monoblocks
Design Notes
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Cannon have responded to meet these
requirements - the result is TEMPUS
CBC 20, a two part modular plug and
receptacle connector system. TEMPUS
CBC 20 is suitable for a variety of
equipment ranging from laptops to
mainframes, custom miniature packag-
ing to telecom systems. There are high
Tempus CBC 20
Introduction
With the growth of system circuit size
combined with the requirement to
manipulate larger amounts of data at
greater speeds, bus systems and their
interconnect components are being
pushed to their limits by the latest
microprocessors. The restrictions
imposed by using the DIN 41612 con-
nector and existing bus architecture are
now becoming evident. The electronics
industry also accepts the requirements
to obey metric dimensional practices for
future generations of components and
equipment.
density connectors already on the mar-
ket at present but none have been
designed with such a system approach
in mind and therefore the ability to
expand as required by technology.
TEMPUS CBC 20 contacts are laid out
in four and more rows on a 2 mm pitch
rather than three rows on a 0.1 inch
pitch. This gives the designer the facilli-
ty of 240 I/O lines in the same area pre-
viously occupied by a 96 way DIN
41612 style connector. Using TEMPUS
as opposed to DIN 41612 connectors
456 and more rather than 192 signal
positions may be obtained on a double
euroboard, over twice as many I/O
lines, giving the ability to address large
bus widths.
Benefits
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Designed to conform with
International specifications
IEC 61076-4-104, IEE P896
Futurebus+, IEC 917 metric
modular order
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4 and 5 row high density
connections with 2 mm x 2 mm
circuit grid
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Push-fit peg at receptacles and
rightangle males eliminate heat-
staking and problems associated
with this process
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End-to-End stackable with no
loss of positions
Application Tool
Overview
Backplane Assembly
Press Blocks, Support Blocks
Right Angle Connectors
Pushfit Press-in Tool
Shroud Assembly
Backplane Repair
Cable Connector Assembly
Product Safety Information
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High performance contacts,
high Hertz stress
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Customized monoblock styles
can be produced in economically
valid quantities
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High temperature materials, not
affected by solder processes
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Solder and press-fit
terminations are available
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Modular design for signal and
power connectors
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Sequential mating provides live
insertion capability
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Bellcore / CSA / UL approved
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Produced under ISO 9001
Quality Management System
Dimensions are shown mm (inch)
Dimensions subject to change
1
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2 mm Interconnect
Industry Standard
•
designed to conform with connector
Live Insertion Capability
specifications IEC61076-4-104,
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signal and power pins are available
EIAis64 and CECC draft 75101-810.
in various lengths and positions
within the connector modules
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designed to conform with the
Power Handling
system build specifications of
IEC917, IEEE1301 and IEEE1301.1
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power modules available for 3 and
40 Amps, suitable for backplane
internal power planes or bus-bar
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selected as the interconnection
power levels
system for Futurebus+, general
computer, input/output and telecom
True Modular System
profiles and Scalabe Coherent
Interface
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the ability to mix signal and power
with no loss of signal position with
the easy addition of coax, fibre
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qualified within major computer,
optics and other features
telecom and backplane
manufacturers throughout America,
Europe, Japan and the Pacific rim
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flexible
mix of technology and
features allows freedom in design
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standardisation guarantees multi-
sourcing and compatibility with third
Monoblock Capability
party equipment
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to complement the modular system
signals, power and other features
2mm Pitch
are available within a single block
for ease of application and a
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the optimum connector pitch with
lowering of cost in volume
reference to price and performance,
applications
greater contact density with no large
increase in board and assembly
costs
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unique modular mould tools allow
custom connectors at attractive
High I/O
prices
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provides over twice the signal pin
availability of DIN41612 on a double
Low Cost Application
eurocard
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pushfit pegs on plug-in board
mounted modules as an alternative
to the standardised heat stake.
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on a double eurocard: TEMPUS
Simple and fast application with “flat
can provide 456 contacts (4 row) or
rock“ type tooling
570 contacts (5 row), for reference
DIN41612 provides 192 contacts
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full application tool support for small
Optimum Performance
to large volumes and connector
repair
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45° legform for mechanical stability
and shortest stub length and highest
Choice of Application and
signal speed
Termination
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high I/O allows practical inclusion of
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solder and pressfit termination on
backplane and circuit board
ground return patterns for optimal
mounted connectors
signal integrity
Tempus CBC 20
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pressfit contacts with pushfit pegs
for fast application in mass
production
High Performance Contacts
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High hertz stress design for high
reliability
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low insertion force (approximately
half of DIN 41612 per signal
contact)
high cycle rate at low cost, 1000
cycles minimum as standard
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Polarisaton
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polarised by design
Coding
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coding with no loss of contact
positions
Total System Capability
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signal
power
high power
coaxial
guiding pins
guiding with early ground
cable
shrouds
right angle males
coding
fibre optics
backplane extension
shielding
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for high speed, 640 Mbits/s, signal
rise times typically ten times faster
than VMEbus with low crosstalk
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high temperature materials allow
use within surface mount assembly
environments
Dimensions are shown mm (inch)
Dimensions subject to change
2
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2 mm Interconnect
General Data
Tempus CBC 20
TEMPUS is a reverse system with the male pin contacts mounted on the backplane and the female socket contacts
mounted on the daughtercard.
Contact Pitch
2,00 x 2,00 (.079 x .079)
Standard Module Arrangement and Size
Number of Contacts Layouts
24 signal
48 signal
96 signal
192 signal
30 signal
60 signal
120 signal
240 signal
8 power
10 power
Standard Contact Mating Length
mm(inches)
Signal
4x6
4 x 12
4 x 24
4 x 48
5x6
5 x 12
5 x 24
5 x 48
4x2
5x2
Module Length
12,00 (.470)
24,00 (.940)
48,00 (1.890)
96,00 (3.780)
12,00 (.470)
24,00 (.940)
48,00 (1.890)
96,00 (3.780)
12,00 (.470)
12,00 (.470)
5,00 (.197)
5,75 (.226)
6,50 (.256)
7,25 (.285)
8,00 (.315)
Power
6,50 (.256)
7,25 (.285)
8,00 (.315)
Contact Arrangement
Refer to relevant connector design notes, all arrangements are standardised in
accordance with IEC, EIA and IEEE specifications.
High Temperature Thermoplastic LCP (liquid crystal polymer) or PPS
UL 94V-0
CuSn6 (phosphor bronze) on female solder and press-fit
CuSn (phosphor bronze) on male press-fit / solder
Brass on male solder
Palladium Nickel plus Gold over Nickel base
Tin lead solder
Insulator Material
Flammability Rating
Contact Materials and Plating
Plating Options
Contact Area
Termination Finish
Test Data Overview
Full test reports are available upon
request. The following lists the IEC
specification requirements.
Dimensions are shown mm (inch)
Dimensions subject to change
3
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