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IS63LV1024-15H: 产品描述Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32; 产品类别存储存储; 文件大小50KB，共8页; 制造商Integrated Silicon Solution ( ISSI )

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IS63LV1024-15H概述

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32

IS63LV1024-15H规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
零件包装代码	TSOP1
包装说明	8 X 13.40 MM, STSOP1-32
针数	32
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.B
最长访问时间	15 ns
JESD-30 代码	R-PDSO-G32
JESD-609代码	e0
长度	11.8 mm
内存密度	1048576 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	32
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP1
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8 mm
Base Number Matches	1

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IS63LV1024

128K x 8 HIGH-SPEED CMOS STATIC RAM

3.3V REVOLUTIONARY PINOUT

FEATURES

• High-speed access times:

10, 12 and 15 ns

• High-performance, low-power CMOS process

• Multiple center power and ground pins for

greater noise immunity

• Easy memory expansion with

and

options

•

power-down

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Single 3.3V power supply

• Packages available:

– 32-pin 300-mil SOJ

– 32-pin 400-mil SOJ

– 32-pin TSOP (Type II)

– 32-pin sTSOP (Type I, 8x13.4)

ISSI

JULY 1999

DESCRIPTION

The

ISSI

IS63LV1024 is a very high-speed, low power,

131,072-word by 8-bit CMOS static RAM in revolutionary

pinout. The IS63LV1024 is fabricated using

ISSI

's high-

performance CMOS technology. This highly reliable pro-

cess coupled with innovative circuit design techniques,

yields higher performance and low power consumption

devices.

When

is HIGH (deselected), the device assumes a

standby mode at which the power dissipation can be

reduced down to 250

µW

(typical) with CMOS input levels.

The IS63LV1024 operates from a single 3.3V power

supply and all inputs are TTL-compatible.

FUNCTIONAL BLOCK DIAGRAM

A0-A16

DECODER

128K X 8

MEMORY ARRAY

VCC

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

This document contains PRELIMINARY information. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible

Integrated Silicon Solution, Inc.

SR010-1F

07/23/99

IS63LV1024-15H相似产品对比

	IS63LV1024-15H	IS63LV1024-12H	IS63LV1024-12HI	IS63LV1024-15HI	IS63LV1024-10H
描述	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32
是否无铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合
零件包装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
包装说明	8 X 13.40 MM, STSOP1-32	8 X 13.40 MM, STSOP1-32	8 X 13.40 MM, STSOP1-32	8 X 13.40 MM, STSOP1-32	8 X 13.40 MM, STSOP1-32
针数	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
最长访问时间	15 ns	12 ns	12 ns	15 ns	10 ns
JESD-30 代码	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609代码	e0	e0	e0	e0	e0
长度	11.8 mm	11.8 mm	11.8 mm	11.8 mm	11.8 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8
湿度敏感等级	3	3	3	3	3
功能数量	1	1	1	1	1
端子数量	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	85 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.45 V	3.45 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3.15 V	3.15 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	8 mm	8 mm	8 mm	8 mm	8 mm
Base Number Matches	1	1	1	1	-
厂商名称	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )

IS63LV1024-15H

IS63LV1024-15H概述

IS63LV1024-15H规格参数

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IS63LV1024-15H相似产品对比

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