Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Terminals for Molded & FR-4 Low Insertion Force PGA Sockets
Standard Quick Turn Terminal
Type -01
.072 Dia.
(1.83)
Type -04
.072 Dia.
(1.83)
Type -29
.072 Dia.
(1.83)
Type -51
.072 Dia.
(1.83)
Type -49
Not available in 1 oz.
.072 Dia.
(1.83)
.165
(4.19)
.120
(3.05)
.165
(4.19)
.130
(3.30)
.095
(2.41)
.125
(3.18)
.020 Dia.
(.51)
.028 Dia.
(.71)
.110
(2.79)
.170
(4.32)
.020 Dia.
(.51)
.020 Dia.
(.51)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
PGA
Quick turn delivery available on standard terminal types.
Additional terminal types available. See terminal section for detailed terminal information.
Solder Preform PGA Sockets - Intrusive Reflow Application
Solder Preform
PC Board
Features:
• Combines the labor of socket loading and
solder application into one operation.
• Eliminates the use of solder paste and
screening operation.
• Eliminates solder bridges and/or solder
shorts due to excess solder.
• Ensures a reliable solder joint with
controlled solder volume.
• Ideal for surface mount and mixed
technology applications.
• For custom solder preform terminal
applications consult factory.
• See previous page for material
specifications and how to order information.
Preform After
Solder Flow
Solder Preform Terminals
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 33
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
