Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 |
Reach Compliance Code | compliant |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e3 |
长度 | 14 mm |
湿度敏感等级 | 3 |
可配置逻辑块数量 | 1536 |
等效关口数量 | 60000 |
输入次数 | 71 |
逻辑单元数量 | 1536 |
输出次数 | 71 |
端子数量 | 100 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
组织 | 1536 CLBS, 60000 GATES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFQFP |
封装等效代码 | TQFP100,.63SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 1.5,1.5/3.3 V |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 | 1.575 V |
最小供电电压 | 1.425 V |
标称供电电压 | 1.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 14 mm |
Base Number Matches | 1 |
A3PN060-ZVQG100 | A3PN030-ZQNG48 | A3PN250-ZVQG100 | A3PN030-ZVQG100 | |
---|---|---|---|---|
描述 | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | Field Programmable Gate Array, 768 CLBs, 30000 Gates, 768-Cell, CMOS, 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | Field Programmable Gate Array, 768 CLBs, 30000 Gates, 768-Cell, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
包装说明 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 |
Reach Compliance Code | compliant | compliant | compli | compli |
JESD-30 代码 | S-PQFP-G100 | S-XQCC-N48 | S-PQFP-G100 | S-PQFP-G100 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 14 mm | 6 mm | 14 mm | 14 mm |
可配置逻辑块数量 | 1536 | 768 | 6144 | 768 |
等效关口数量 | 60000 | 30000 | 250000 | 30000 |
输入次数 | 71 | 34 | 68 | 77 |
逻辑单元数量 | 1536 | 768 | 6144 | 768 |
输出次数 | 71 | 34 | 68 | 77 |
端子数量 | 100 | 48 | 100 | 100 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C |
组织 | 1536 CLBS, 60000 GATES | 768 CLBS, 30000 GATES | 6144 CLBS, 250000 GATES | 768 CLBS, 30000 GATES |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFQFP | HQCCN | TFQFP | TFQFP |
封装等效代码 | TQFP100,.63SQ | LCC48,.24SQ,16 | TQFP100,.63SQ | TQFP100,.63SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 1.5,1.5/3.3 V | 1.5,1.5/3.3 V | 1.5,1.5/3.3 V | 1.5,1.5/3.3 V |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 1.575 V | 1.575 V | 1.575 V | 1.575 V |
最小供电电压 | 1.425 V | 1.425 V | 1.425 V | 1.425 V |
标称供电电压 | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.4 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 40 |
宽度 | 14 mm | 6 mm | 14 mm | 14 mm |
湿度敏感等级 | 3 | - | 3 | 3 |
座面最大高度 | 1.2 mm | - | 1.2 mm | 1.2 mm |
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