AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20
| 参数名称 | 属性值 |
| 零件包装代码 | QFN |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | AHCT/VHCT |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 11.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| SN54AHCT374FKR | SN54AHCT374FK | SN54AHCT374WR | SN74AHCT374DGV | |
|---|---|---|---|---|
| 描述 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | AHCT/VHCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, TVSOP-20 |
| 零件包装代码 | QFN | QFN | DFP | SOIC |
| 包装说明 | QCCN, | QCCN, | DFP, | PLASTIC, TVSOP-20 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F20 | R-PDSO-G20 |
| 长度 | 8.89 mm | 8.89 mm | 13.09 mm | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCN | QCCN | DFP | TSSOP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 11.5 ns | 11.5 ns | 11.5 ns | 11.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2.03 mm | 2.54 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | FLAT | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL |
| 宽度 | 8.89 mm | 8.89 mm | 6.92 mm | 4.4 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - |
| Base Number Matches | 1 | 1 | 1 | - |
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