电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IS66WVE1M16ALL-70BLI

产品描述Pseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48
产品类别存储    存储   
文件大小516KB,共30页
制造商Integrated Silicon Solution ( ISSI )
标准  
下载文档 详细参数 选型对比 全文预览

IS66WVE1M16ALL-70BLI概述

Pseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48

IS66WVE1M16ALL-70BLI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DSBGA
包装说明6 X 8 MM, LEAD FREE, MO-207, TFBGA-48
针数48
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间70 ns
I/O 类型COMMON
JESD-30 代码R-PBGA-B48
JESD-609代码e1
长度8 mm
内存密度16777216 bit
内存集成电路类型PSEUDO STATIC RAM
内存宽度16
湿度敏感等级3
功能数量1
端子数量48
字数1048576 words
字数代码1000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA48,6X8,30
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源1.8 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.00001 A
最小待机电流1.7 V
最大压摆率0.03 mA
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度6 mm
Base Number Matches1

文档预览

下载PDF文档
IS66WVE1M16ALL
Advanced Information
1.8V Core Async/Page PSRAM
Overview
The IS66WVE1M16ALL is an integrated memory device containing 16Mbit Pseudo Static Random Access
Memory using a self-refresh DRAM array organized as 1M words by 16 bits. The device includes several
power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and
Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power
rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core.
Features
Asynchronous and page mode interface
Dual voltage rails for optional performance
VDD 1.8V, VDDQ 1.8V
Page mode read access
Interpage Read access : 70ns
Intrapage Read access : 20ns
Low Power Consumption
Asynchronous Operation < 30 mA
Intrapage Read < 18mA
Standby < 80 uA (max.)
Deep power-down (DPD) < 3uA (Typ)
Low Power Feature
Temperature Controlled Refresh
Partial Array Refresh
Deep power-down (DPD) mode
Operating temperature Range
Industrial -40°C~85°C
Package:
48-ball TFBGA, 48-pin TSOP-I
Notes :
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM marketing at
sram@issi.com
for
additional information.
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev.00C | November 2010
www.issi.com
- SRAM@issi.com
1

IS66WVE1M16ALL-70BLI相似产品对比

IS66WVE1M16ALL-70BLI IS66WVE1M16ALL-70BLI-TR
描述 Pseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48 Memory IC, 1MX16, CMOS, PBGA48
是否Rohs认证 符合 符合
Reach Compliance Code compliant compliant
最长访问时间 70 ns 70 ns
I/O 类型 COMMON COMMON
JESD-30 代码 R-PBGA-B48 R-PBGA-B48
内存密度 16777216 bit 16777216 bit
内存宽度 16 16
端子数量 48 48
字数 1048576 words 1048576 words
字数代码 1000000 1000000
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
组织 1MX16 1MX16
输出特性 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA FBGA
封装等效代码 BGA48,6X8,30 BGA48,6X8,30
封装形状 RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
电源 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified
最大待机电流 0.00001 A 0.00001 A
最小待机电流 1.7 V 1.7 V
最大压摆率 0.03 mA 0.03 mA
标称供电电压 (Vsup) 1.8 V 1.8 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL
端子节距 0.75 mm 0.75 mm
端子位置 BOTTOM BOTTOM
Base Number Matches 1 1
电路学习指导 范世贵
552280 ...
nahan 下载中心专版
有wince camera驱动的高手吗?
wince camera驱动及图象处理群:13395498 请高手加入,有疑难问题请教...
3134162 嵌入式系统
三相信号发生器论文----学校国赛选拔赛初赛
本帖最后由 paulhyde 于 2014-9-15 03:49 编辑 精度控制较好 ...
理工小朱 电子竞赛
请教高手模电知识
长尾式差动放大电路的等效电路中,三极管发射极为什么是等效接地? 模电书上说“由于E点点位在差模信号作用下不变,相当于接地;又由于负载电阻的中点点位在差模信号作用下也不变,也相当于接 ......
whwshiyuan1984 模拟电子
cordic IP求相位的连续问题
用cordic IP核求信号相位角,如何保障相位的连续性,IP核只能求在-pi到pi之间...
abcd12096565 FPGA/CPLD
MLC NandFlash K9G8G08 的问题
环境:Eboot + Wince 6.0,pxa270 CPU,Samsung K9G8G08 1G Bytes NandFlash。 现象:在nandflash存储的数据丢失。 往nandflash里面拷贝程序,都可用。但是一重启就丢失了。 nandflash分为 ......
双手互搏 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 107  1755  916  2704  1511  19  27  30  5  48 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved