Microcontroller, 8-Bit, MROM, MOS, PDIP28, 0.400 INCH, SHRINK, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | SDIP, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 5 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 25.4 mm |
| I/O 线路数量 | 20 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 1.8 V |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.778 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| UPD789104CT-XXX | UPD789101CT-XXX | UPD789102GS-XXX | UPD789102CT-XXX | UPD789104GS-XXX | |
|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, MOS, PDIP28, 0.400 INCH, SHRINK, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, MOS, PDIP28, 0.400 INCH, SHRINK, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, MOS, PDSO30, 0.300 INCH, SHRINK, PLASTIC, SOP-30 | Microcontroller, 8-Bit, MROM, MOS, PDIP28, 0.400 INCH, SHRINK, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, MOS, PDSO30, 0.300 INCH, SHRINK, PLASTIC, SOP-30 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | SOIC | DIP | SOIC |
| 包装说明 | SDIP, | SDIP, | SSOP, | SDIP, | 0.300 INCH, SHRINK, PLASTIC, SOP-30 |
| 针数 | 28 | 28 | 30 | 28 | 30 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 具有ADC | YES | YES | YES | YES | YES |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G30 | R-PDIP-T28 | R-PDSO-G30 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 25.4 mm | 25.4 mm | 9.85 mm | 25.4 mm | 9.85 mm |
| I/O 线路数量 | 20 | 20 | 20 | 20 | 20 |
| 端子数量 | 28 | 28 | 30 | 28 | 30 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | SDIP | SSOP | SDIP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2 mm | 5.08 mm | 2 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | NO | NO | YES | NO | YES |
| 技术 | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.778 mm | 1.778 mm | 0.65 mm | 1.778 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | 10.16 mm | 6.1 mm | 10.16 mm | 6.1 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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