Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type:
ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
n
Features
l
Small size and lightweight
l
High reliability
Metal glaze thick film resistive element and three layers of electrodes
l
Compatible with placement machines
Taping and bulk case packaging available
l
Suitable for both reflow and flow soldering
l
Approved under the ISO 9001 system
Approved under the QS-9000 system
l
Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
n
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
Product Code
Thick Film
Chip Resistors
R
J
3
G
E
Marking
Marking
Y
J
1
0
2
V
Size, Power Rating
Type : inches Power R.
0.05 W
1GE : 0201
0.063 W
2GE : 0402
0.1 W
3GE : 0603
0.125 W
6GE : 0805
0.25 W
8GE : 1206
0.25 W
14 : 1210
0.5 W
12 : 1812
0.5 W
12Z : 2010
1W
1T : 2512
Resistance Tolerance
Code
J
0
Tolerance
±
5%
Jumper
Code
Y
Code
]
Nil
Value Marking on
black side
No marking
Packaging Specifications
Packaging
Punched (Paper) Taping
V
(Only 3G, 6G, 8G type)
Embossed Taping
(Only 14, 12, 12Z, 1T type)
Bulk case
(Only 2G, 3G, 6G type)
Punched (Paper) Taping
2 mm pitch, 10000 pcs.
U
B
X
(Only 2G, 3G type)
Punched (Paper) Taping
2 mm pitch, 20000 pcs.
Resistance Value
The first two digits are significant figures of resistance and
the third one denotes number of zeros following. Decimal
Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
]
When partly omitted, all the rest P/N factors should be moved up respectively.
Y
(Only 2G type)
C
Punched (Paper) Taping
2 mm pitch, 15000 pcs.
(Only 1G type)
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Thick Film Chip Resistors
n
Construction
n
Dimensions in mm (not to scale)
a
Protective coating
L
W
Termination (Inner)
High purity alumina
substrate
t
b
Type
(inches)
Termination
(Between)
Dimensions (mm)
L
W
a
b
t
0.60
±0.03
0.30
±0.03
0.12
±0.05
0.15
±0.05
0.25
±0.05
1.00
±0.05
0.50
±0.05
0.20
±0.10
0.25
±0.05
0.35
±0.05
1.60
±0.15
0.80
+0.15
0.30
±0.20
0.30
±0.15
0.45
±0.10
Ð0.05
2.00
±0.20
1.25
±0.10
0.40
±0.20
0.40
±0.20
0.60
±0.10
3.20
+0.05
1.60
+0.05
0.50
±0.20
0.50
±0.20
0.60
±0.10
Ð0.20
Ð0.15
3.20
±0.20
2.50
±0.20
0.50
±0.20
0.50
±0.20
0.60
±0.10
4.50
±0.20
3.20
±0.20
0.50
±0.20
0.50
±0.20
0.60
±0.10
5.00
±0.20
2.50
±0.20
0.60
±0.20
0.60
±0.20
0.60
±0.10
6.40
±0.20
3.20
±0.20
0.65
±0.20
0.60
±0.20
0.60
±0.10
Weight
(1000 pcs.)
0.15 g
0.8 g
2g
4g
10 g
16 g
27 g
27 g
45 g
Resistive element
Termination (Outer)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
ERJ1T
(2512)
n
Ratings
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812, 2010)
ERJ1T
(2512)
Power Rating Limiting Element Maximum Overload
Resistance
Voltage (Maximum Voltage
(2)
at 70 ¡C
Tolerance(%)
RCWV)
(1)
(V)
(W)
(V)
0.05
0.063
0.1
0.125
0.25
0.25
0.5
1
15
50
50
150
200
200
200
200
30
100
100
200
400
400
400
400
Rated Current
Jumper
1G
2G á 3G
6Gá8Gá14á12á12Zá1T
0.5 A
1 A
2 A
±5
±5
±5
±5
±5
±5
±5
±5
Resistance Range (W)
min.
10
1
1
1
1
1
1
1
max.
1 M
2.2 M
10 M
10 M
10 M
10 M
10 M
1 M
1 MW<:
Ð400 to
+150
10
W
to
1 MW:
±200
T.C.R.
Standard
´10
-6
/¡C
Resistance Values
(ppm/¡C)
<10 W:
Ð100 to
+600
E24
E24
E24
E24
E24
E24
E24
E24
Maximum Overload Current
1A
2A
4A
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV=
Ö
Power Rating
´
Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever is less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5
´
Power Rating or max. Overload Voltage listed above
whichever is less.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Rated Load (%)
Power Derating Curve
For resistors operating in ambient temperature above
70 ¡C, power rating should be derated in accordance
with the right figure.
Ð55
70 ¡C
100 ¡C
80
60
3G, 6G, 8G
40
1G,2G,14,12,12Z,1T
155 ¡C
20
125 ¡C
0 Ð40 Ð20 0 20 40 60 80 100 120 140 160 180
Ð60
Ambient Temperature (¡C)
Thick Film Chip Resistors
n
Packaging Specifications
l
Standard Quantity
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12,12Z
(1812, 2010)
ERJ1T
(2512)
l
Taping Reel
Thickness
(mm)
0.25
0.35
0.45
0.6
0.6
0.6
0.6
0.6
Punched (Paper) Taping
15000 pcs./reel (2 mm pitch)
10000
20000
10000
5000
pcs./reel
pcs./reel
pcs./reel
pcs./reel
(2 mm pitch)
(2 mm pitch)
(2 mm pitch)
(4 mm pitch)
]
50000 pcs./case
25000 pcs./case
10000 pcs./case
Embossed Taping
(4 mm pitch)
Bulk Case
5000 pcs./reel (4 mm pitch)
]
5000 pcs./reel (4 mm pitch)
]
5000 pcs./reel
5000 pcs./reel
4000 pcs./reel
]
Please consult us if resistors other than shown above are needed.
l
Bulk Case
(mm)
Slider
6
B
+
B
*
12
38
Shutter
B
)
9
fB
fC
W
T
110
Type
fA
Dimensions
1G,2G,3G
9.0
±1.0
11.4
±2.0
0
(mm)
6G,8G,14
180.0
Ð3.0
60 min. 13.0
±1.0
12,12Z,1T
13.0
±1.0
15.4
±2.0
l
Punched (Paper) Taping
Sprocket hole
B
D
0
A
Compartment
l
Embossed Taping
Sprocket hole
B
D
0
Compartment
F E
W
B
B
T
Chip component
P
1
P
2
P
0
Tape running direction
t
Chip component
P
1
P
2
P
0
B
D
1
Tape running direction
Type
1G
Dimensions
2G
3G
(mm)
6G
8G
A
0.38
0.70
±0.05
1.10
±0.10
1.65
±0.15
2.00
±0.15
±0.05
B
0.68
1.20
±0.05
1.90
±0.10
2.50
±0.20
3.60
±0.20
±0.05
W
F
E
Type
A
B
±0.20
W
±0.30
F
±0.05
F
W
A
E
E
P
1
8.00
±0.20
3.50
±0.05
1.75
±0.10
14
Dimensions
12
(mm)
12Z
1T
2.80
3.50
±0.20
2.80
±0.20
3.60
±0.20
±0.20
3.50
8.00
3.50
±0.20
4.80
1.75
±0.10
4.00
±0.10
5.30
±0.20
12.00
±0.30
5.50
±0.05
6.90
±0.20
P
0
4.00
±0.10
fD
0
1.50
+0.10
0
t
1.00
±0.10
fD
1
1 min.
1.5 min.
Type
P
1
1G
2.00
±0.10
2G
Dimensions
3G
(mm)
6G
4.00
±0.10
8G
P
2
P
0
fD
0
2.00
±0.05
4.00
±0.10
1.50
+0.10
0
T
0.47
±0.05
0.52
±0.05
0.70
±0.05
0.84
±0.05
Type
P
2
14
Dimensions
12
2.00
±0.05
(mm)
12Z
1T
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Thick Film Chip Resistors
n
Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Type
(inches)
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
Dimensions (mm)
a
b
c
0.3 to 0.4
0.8 to 0.9 0.25 to 0.35
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
0.7 to 0.9
2 to 2.2
0.8 to 1
1 to 1.4
3.2 to 3.8
0.9 to 1.4
2 to 2.4
4.4 to 5
1.2 to 1.8
2 to 2.4
4.4 to 5
1.8 to 2.8
3.3 to 3.7
5.7 to 6.5
2.3 to 3.5
3.6 to 4
6.2 to 7
1.8 to 2.8
5 to 5.4
7.6 to 8.6
2.3 to 3.5
Chip Resistor
a
b
n
Recommended Soldering Conditions
Recommendations and precautions are described below.
l
Recommended soldering conditions for reflow
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
áPlease measure the temperature of terminations and study
every type of printed circuit board for solderability, before
actual use.
c
For soldering (Example : Sn/Pb)
Temperature
Preheating
Main heating
Peak
140 ¡C to 160 ¡C
Above 200 ¡C
235 ± 5 ¡C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Peak
Temperature
Preheating
Heating
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Main heating
Peak
150 ¡C to 180 ¡C
Above 230 ¡C
max. 260 ¡C
60 s to 120 s
30 s to 40 s
max. 10 s
Time
l
Recommended soldering conditions for flow
For soldering
Temperature
Preheating
Soldering
140 ¡C to 160 ¡C
245±5 ¡C
Time
60 s to 120 s
20 s to 30 s
For lead-free soldering
Temperature
150 ¡C to 180 ¡C
max. 260 ¡C
Time
60 s to 120 s
max. 10 s
Safety Precautions
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
impair performance and/or reliability of the resistor.
Never exceed the specified rated power.
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
the resistors.
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
damage the protective coating of the resistor and may affect its performance.
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
