FEATURES AND SPECIFICATIONS
Molex offers the Fully Buffered DIMM with color options for server applications.
The development of Fully Buffered DIMM (FB DIMM) came from the need for larger
and faster memory capacity where memory coordination and accuracy at high speeds
are critical which DDR2 is not capable of supporting.
The FB DIMM is a variant of the DDR2. It combines the high-speed internal
architecture of DDR2 with a bi-directional point-to-point serial memory interface
which links each FB DIMM module together in a chain. The difference is here in which
the DDR2 uses a single memory bus.
Molex is an active member of the JEDEC work group that defines industry standards
for memory. This allows Molex to ensure that all our memory sockets are 100%
industry compatible.
1.00mm (.039") Pitch
Fully Buffered DIMM Socket
240 Circuit
With Color Options
48206
Vertical, Through Hole
Features
• High-temperature thermoplastic housing
• Accepts JEDEC defined module MO-256
• Complies with JEDEC SO-003 socket specifications
• Dual ejector latches
• Built in end key design
• Latch tower support
• Beveled metal pins (forklocks)
Benefits
• Lead-free process compatible
• Ensures 100% industry compatibility
• Ensures easy module insertion and removal with minimal micro
motion
• Ensures correct insertion of FB memory module
• Aids in keeping the module vertical
• Provides proper socket to PCB alignment and retention, during and
after soldering
SPECIIFICATIONS
Reference Information
Packaging: Tray
UL File No.: TBD
CSA File No.:TBD
Mates With: JEDEC MO-256 memory modules
Complies with: JEDEC SO-003 Socket Outline
Designed In: Millimeters
Electrical
Voltage: 30V
Current: 0.5A
Contact Resistance: 20 milliohms max
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 Megohms min
Mechanical
Contact retention to housing: 3N min (Contact)
13N min (Forklock)
Insertion Force to PCB: 0.56N (0.13lb)
Mating Force: 0.81N (0.18lb)
Unmating Force: 0.02N (0.01lb)
Latch Actuation Force: 45N max per latch
Durability: 10 Cycles
Physical
Housing: See order table
Flammability rating: UL 94V-0
Contact: Copper (Cu) Alloy
PCB thickness: 1.60mm (.062”)
Plating:
Contact Area — See order table
Solder Tail Area —Tin (Sn), Lead-free
Underplating — Nickel
Operating Temperature: +260°C max.
ORDERING INFORMATION
1.00mm (.039") Pitch
Fully Buffered DIMM Socket
240 Circuit
With Color Options
48206
Vertical, Through Hole
Description
Lead-Free
Ordering
48206-0001
Plating
0.38µm (15µ")
Gold (Au)
Features
Solder Tail Length Latch Color Housing Recommended PCB Thickness
0.76µm (30µ")
48206-0002
Gold (Au)
48206-0003
0.38µm (15µ")
Gold (Au)
2.67mm (.105")
0.76µm (30µ")
48206-0004
Gold (Au)
48206-0005
48206-0006
Gold (Au)
Flash
Gold (Au)
Flash
0.38µm (15µ")
Gold (Au)
0.76µm (30µ")
Gold (Au)
0.38µm (15µ")
Gold (Au)
0.76µm (30µ")
Gold (Au)
Gold (Au)
Flash
Gold (Au)
Flash
0.38µm (15µ")
Gold (Au)
0.76µm (30µ")
Gold (Au)
0.38µm (15µ")
Gold (Au)
0.76µm (30µ")
Gold (Au)
Gold (Au)
Flash
3.18mm (.125")
White
Nylon 4/6,
Black
1.60mm (.062")
2.67mm (.105")
3.18mm (.125")
2.67mm (.105")
2.67mm (.105")
3.18mm (.125")
Black
3.18mm (.125")
2.67mm (.105")
3.18mm (.125")
2.67mm (.105")
2.67mm (.105")
3.18mm (.125")
White
3.18mm (.125")
2.67mm (.105")
48206-0101
48206-0102
FB DIMM
Socket,
Vertical, with 48206-0103
Beveled Metal
Pins,
48206-0104
1.8V Center
48206-0105
48206-0106
48206-9001
48206-9002
48206-9003
48206-9004
48206-9005
Nylon 4/6,
Black
1.60mm (.062")
Nylon 6/6,
Blue
1.60mm (.062")
Bringing People & Technology Together, Worldwide
SM
Americas Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
630-969-4550
Visit our Web site at http://www.molex.com
Order No. SNG-055
©2006, Molex
FPGA/CPLD
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