SPECIALTY LOGIC CIRCUIT, CQCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCN, |
| Reach Compliance Code | not_compliant |
| 系列 | LS |
| JESD-30 代码 | S-CQCC-N20 |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| SNJ54LS626FK | SNJ54LS626W | SNJ54LS627J | SNJ54LS624W | SNJ54LS624J | SNJ54LS624J883B | SNJ54LS624FK | SNJ54LS627FK | SNJ54LS627W | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPECIALTY LOGIC CIRCUIT, CQCC20 | SPECIALTY LOGIC CIRCUIT, CDFP16 | SPECIALTY LOGIC CIRCUIT, CDIP14 | SPECIALTY LOGIC CIRCUIT, CDFP14 | SPECIALTY LOGIC CIRCUIT, CDIP14 | SPECIALTY LOGIC CIRCUIT, CDIP14, DIP-14 | SPECIALTY LOGIC CIRCUIT, CQCC20 | SPECIALTY LOGIC CIRCUIT, CQCC20 | SPECIALTY LOGIC CIRCUIT, CDFP14 |
| 包装说明 | QCCN, | DFP, | DIP, | DFP, | DIP, | DIP, | QCCN, | QCCN, | DFP, |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown | not_compliant | _compli | _compli |
| 系列 | LS | LS | LS | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | S-CQCC-N20 | R-CDFP-F16 | R-CDIP-T14 | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | S-CQCC-N20 | S-CQCC-N20 | R-CDFP-F14 |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 功能数量 | 2 | 2 | 2 | 1 | 1 | 1 | 1 | 2 | 2 |
| 端子数量 | 20 | 16 | 14 | 14 | 14 | 14 | 20 | 20 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DFP | DIP | DFP | DIP | DIP | QCCN | QCCN | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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