电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

BTH-060-04-C-D-TR

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小459KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

BTH-060-04-C-D-TR概述

Board Stacking Connector

BTH-060-04-C-D-TR规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codecompliant
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (50)
联系完成终止MATTE TIN
触点材料PHOSPHOR BRONZE
JESD-609代码e3
制造商序列号BTH
Base Number Matches1

文档预览

下载PDF文档
REVISION AL
(No OF POS. x .01969[.5000]) + .1968[5.000] REF
(No OF POSITIONS -1) x .01969[.5000]
DO NOT
SCALE FROM
THIS PRINT
.1082 2.749 REF
.0197±.0030 0.500±0.076 TYP
01
C
BTH-XXX-XX-X-D-XX
No OF POSITIONS
030, ***050, 060, 090,
*120, *150
(PER ROW)
LEAD STYLE -02 ONLY: 030 - 180
MULTIPLES OF 10
*SEE NOTE 7
SEE NOTE 10
LEAD STYLE
-01: .1680[4.267]
-02: .2861[7.264]
(030 -180 POSITIONS AVAILABLE)
-03: .4042[10.267]
-04: .6000[15.240]
-05: .7180[18.237]
-06: .8360[21.234]
-09: .5224[13.269]
*** = 50 POS. ONLY AVAILABLE FOR
-01 AND -02 LEAD STYLE
(REF ASP-65267-02), NOT
TOOLED FOR -03 LEAD STYLE
T-1SXX-XX-X
OPTION
-A: ALIGNMENT PINS
(USE BTH-XXX-XX-D-A FOR
STYLES -01 & -02)(FOR STYLES
-03 THRU -09, SEE TABLE 4 &
FIG 4, SHEET 3)
-LC: LOCKING CLIPS (SEE NOTE 8)"
(USE LC-08-TM-01)
-K: POLYIMIDE FILM
(USE K-DOT-.276-.375-.005, SEE FIG 2)
(AVAILABLE ON STYLES -01
THRU -04 & -09 ONLY)
-TR: TAPE & REEL (120 POS MAX)
[N/A ON -05 THRU -06]
ROW SPECIFICATION
-D: DOUBLE (USE BTH-XXX-XX-D
& BTHH-XXX-XX-D)
PLATING SPECIFICATION
-F: 3µ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL
-L: 10µ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL
-H: 30µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-C: 50µ" GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.0080 0.203
REF
.1550 3.937 REF
(SEE NOTE 9)
02
.2350 5.969
REF
.0470 1.194 REF
BTH-XXX-XX-D
C
"A"
C
.155±.003 3.94±0.076
.055 1.40
"B" REF
C
C
"A"
SEE TABLE 2
(SEE NOTE 3)
.003[.08]
.001[.03]
.0100 0.254 REF
"A"
2 MAX SWAY
(TYP)
LC-08-TM-01
.0370 0.939 REF
.2800 7.112
.0372 0.945 REF
-LC: LOCKING CLIP OPTION SHOWN
.0375 0.952
REF
BTH-XXX-XX-D-A
SECTION "A"-"A"
R
(No OF POS. x .01969[.5000]) + .1368[3.475] REF
-A: ALIGNMENT PIN OPTION SHOWN
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE: 6 OZ. FOR STYLES -01 & -02
8 OZ. FOR STYLES -03 THRU -09
3. MAXIMUM VARIANCE: .002[.05].
4. LEAD STYLES -03 THRU -09: TOP BODY (BTH)
CANNOT HAVE -A OPTION.
5. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
6. NOTE DELETED.
7. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS,PLEASE
CONTACT SAMTEC INTERCONNECT PROCESSING GROUP.
8. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, THE
–LC OPTION IS NOT COMPATIBLE WITH AUTO PLACEMENT.
SAMTEC RECOMMENDS MANUAL PLACEMENT FOR ALL
ASSEMBLIES WITH THE –LC OPTION.
9. PIN CAN EXTEND PAST THE WALL: .003 [.08].
10. FEATURE PRESENT ONLY ON -01 LEAD STYLE.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
.XX: .01[.3]
.XXX: .005 [.13]
.XXXX: .0020 [.051]
MATERIAL:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DO NOT SCALE DRAWING
SHEET SCALE: 1:0.533333
DESCRIPTION:
INSULATOR: BLACK LCP
FLAMMABILITY RATING: UL 94V-O
TERMINAL: PHOS BRONZE
F:\dwg\MISC\Mktg\BTH-XXX-XX-X-D-XX-MKT.SLDDRW
.5mm DOUBLE ROW TERMINAL ASSEMBLY
DWG. NO.
BTH-XXX-XX-X-D-XX
5/28/1999
SHEET
1
OF
3
BY:
DEAN P
当前主流智能家居无线协议哪个优
1、ZigBee主要的频段有868MHz、915MHz、2.4G三个频段信号,868MHz是欧洲常用的频段,915MHz是美国常用的频段,而2.4G是全球通用频段。ZigBee主要特点有:低功耗、自组网、可靠性高、系统性高 ......
fish001 无线连接
PCB问题
想做板子,想问一下 1、S3C2410能用双面板做吗? 2、S3C2440能用双面板做吗? 双面板比较便宜一些,请做过的朋友给解答一下。...
tjj104923185 嵌入式系统
使用techBASIC直接在iPad上编写SensorTag应用
本帖最后由 southwolf1813 于 2014-5-5 14:45 编辑 最近一直比较忙,好多时间都在外面跑,可是已经收了论坛的 SensorTag, 总不能不干活啊… 大家都知道安卓系统是基于linux的,完全可以拿 ......
southwolf1813 无线连接
SD卡问题:将CE5的SD驱动Porting到CE6以后,SD卡的访问速度只有CE5的三分之一
SD卡问题:将CE5的SD驱动Porting到CE6以后,SD卡的访问速度只有CE5的三分之一。 在CE5下,读大概是6MB/Sec, 写大概是4.8MB/Sec. 在CE6下,读大概是2.4MB/Sec, 写大概是500KB/Sec. 请问大家 ......
zhangwf 嵌入式系统
分享一些MSP430进行温度采集和显示设计代码
//********************************************************************************* // 用MSP430的内置温度传感器去测试环境温度,每次测试都与第一次采集到的数据相比较, //如果 ......
Jacktang 微控制器 MCU
LDO 噪声详解
随着通信信道的复杂度和可靠性不断增加,人们对于电信系统的要求和期望也不断提高。这些通信系统高度依赖于高性能、高时钟频率和数据转换器器件,而这些器件的性能又非常依赖于系统电源轨的质量 ......
499362154 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2804  2093  607  855  703  54  10  19  56  50 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved