电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT54FCT162373TE

产品描述Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48
产品类别逻辑    逻辑   
文件大小112KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT54FCT162373TE概述

Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48

IDT54FCT162373TE规格参数

参数名称属性值
零件包装代码DFP
包装说明DFP,
针数48
Reach Compliance Codeunknown
其他特性MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C
系列FCT
JESD-30 代码R-GDFP-F48
JESD-609代码e0
长度15.748 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
位数8
功能数量2
端口数量2
端子数量48
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料CERAMIC, GLASS-SEALED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
传播延迟(tpd)15 ns
认证状态Not Qualified
座面最大高度2.1844 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距0.635 mm
端子位置DUAL
宽度9.652 mm
Base Number Matches1

文档预览

下载PDF文档
IDT54/74FCT162373T/AT/CT/ET
FAST CMOS 16-BIT TRANSPARENT LATCH
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
FAST CMOS 16-BIT
TRANSPARENT
LATCH
FEATURES:
0.5 MICRON CMOS Technology
High-speed, low-power CMOS replacement for ABT functions
Typical t
SK
(o) (Output Skew) < 250ps
Low input and output leakage
≤1µ
A (max.)
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
V
CC
= 5V ±10%
Balanced Output Drivers:
±24mA (industrial)
±16mA (military)
Reduced system switching noise
Typical VOLP (Output Ground Bounce) < 0.6V at V
CC
= 5V,
T
A
=
25°C
Available in the following packages:
Industrial: SSOP, TSSOP, TVSOP
Military: CERPACK
IDT54/74FCT162373T/AT/CT/ET
DESCRIPTION:
The FCT162373T 16-bit transparent D-type latch is built using ad-
vanced dual metal CMOS technology. This high-speed, low-power latch is
ideal for temporary storage of data. It can be used for implementing memory
address latches, I/O ports, and bus drivers. The Output Enable and Latch
Enable controls are organized to operate each device as two 8-bit latches,
or one 16-bit latch. Flow-through organization of signal pins simplifies layout.
All inputs are designed with hysteresis for improved noise margin.
The FCT162373T has balanced output drive with current limiting
resistors. This offers low ground bounce, minimal undershoot, and
controlled output fall times– reducing the need for external series terminating
resistors. The FCT162373T is a plug-in replacement for the FCT16373T
and ABT16373 for on-board interface applications.
FUNCTIONAL BLOCK DIAGRAM
1
OE
2
OE
1
LE
1
D
1
2
LE
D
1
O
1
2
D
1
D
2
O
1
C
C
TO SEVEN OTHE R CHANNELS
TO SEVEN OTHER CHANN ELS
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
1
c
1999 Integrated Device Technology, Inc.
JUNE 2000
DSC-5455/-

IDT54FCT162373TE相似产品对比

IDT54FCT162373TE IDT54FCT162373ATE IDT54FCT162373CTE IDT54FCT162373CTEB IDT54FCT162373ETEB IDT54FCT162373ATEB IDT54FCT162373TEB
描述 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48
零件包装代码 DFP DFP DFP DFP DFP DFP DFP
包装说明 DFP, DFP, DFP, DFP, FL48,.4,25 CERPACK-48 DFP, FL48,.4,25 DFP, FL48,.4,25
针数 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown not_compliant not_compliant not_compliant not_compliant
系列 FCT FCT FCT FCT FCT FCT FCT
JESD-30 代码 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48
长度 15.748 mm 15.748 mm 15.748 mm 15.875 mm 15.875 mm 15.875 mm 15.875 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8 8 8 8
功能数量 2 2 2 2 2 2 2
端口数量 2 2 2 2 2 2 2
端子数量 48 48 48 48 48 48 48
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DFP DFP DFP DFP DFP DFP DFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.1844 mm 2.1844 mm 2.1844 mm 2.413 mm 2.413 mm 2.413 mm 2.413 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 FLAT FLAT FLAT FLAT FLAT FLAT FLAT
端子节距 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm
其他特性 MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C MAX OUTPUT SKEW = 0.5NS; TYP VOLP < 0.6V @ VCC = 5V, TA = 25 DEGREE C - MAX OUTPUT SKEW = 0.5NS; TYP VOLP < 0.6V @ VCC = 5V, TA = 25 DEGREE C MAX OUTPUT SKEW = 0.5NS; TYP VOLP < 0.6V @ VCC = 5V, TA = 25 DEGREE C
JESD-609代码 e0 e0 e0 e0 - e0 e0
传播延迟(tpd) 15 ns 9.8 ns 8 ns 8 ns - 9.8 ns 15 ns
端子面层 TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 - -
是否Rohs认证 - - - 不符合 不符合 不符合 不符合
峰值回流温度(摄氏度) - - - 225 225 225 225
筛选级别 - - - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
处于峰值回流温度下的最长时间 - - - 30 NOT SPECIFIED 30 30
Xilinx FPGA PCB layout guide
31839...
xiaoxin1 FPGA/CPLD
新版本的altium designer 14电气栅格怎么设置呀?
忘了怎么装的了,怎么找不到altium designer 14的帮助文档?在哪里可以下载?好像以前的版本在安装目录里可以找到pdf格式的。现在找不到,在官方网站好像也找不到下载链接,只有在线看或者一次 ......
wangfuchong PCB设计
s3c2410 的RTC实验问题
这是代码: /****************************************Copyright (c)************************************************** ** Guangzhou ZHIYUAN electro ......
znlg37 嵌入式系统
使用emwin两个星期,收集到的一些资料对比分享
使用EMWIN大概2周,实验的平台是STM32F429,太深入的技术分享暂时没有太多,但从一个入门者的角度可以分享一些经历。近期的F7的活动估计很多朋友会用到EMWIN,希望能对大家带来帮助。 ......
fsyicheng stm32/stm8
3GPP&IEEE 802.11,不同的联网技术标准
3GPP 是当今的无线手机通信标准化机构,而 IEEE 802.11 则是无线电脑数据通信的标准化机构。3GPP 主要由手机运营商及其政府赞助部门组成,因为运营商最初都是政府机构(在一些国家,运营 ......
Aguilera 无线连接
cc1101与MSP430G2553的程序调试
extern void Init_CC1101(void); extern void halRfSendPacket(INT8U *txBuffer, INT8U size); extern void POWER_UP_RESET_CC1100(void); extern void halRfWriteRfSettings(void); extern ......
易爆炸弹 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 449  1691  2600  2722  473  6  56  35  29  11 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved