Intel approved CoolFin™ heat sink from Molex achieves high performance and low
noise with innovative design.
Introducing the newest style of Molex heat sinks, CoolFin. CoolFin heat sinks are made from stamped
fins soldered to base plates. CoolFin technology allows for variable fin pitch, geometry, material type
and thickness. They are designed to maximize thermal efficiency in the smallest and lightest weight
package possible.
The 37717 series CoolFin heat sink has been designed to offer superior cooling for the Intel Pentium
“Prescott” microprocessor. It is available in different speeds or can be fitted with a thermistor
controlled fan for motherboards without variable speed fan technology. These fan options help the
customer match cooling requirements with acoustic goals.
The 37717 series fin package has been maximized to meet thermal performance and weight
requirements. In the center fin group, copper is used directly above the heat source to maximize
thermal efficiency. The outer fins are made up of lighter aluminum material to save weight. The two
heat pipes further increase efficiency and create 16-17% margin at the highest fan speed; this allows
customers to explore lower speed fans for better acoustics. The innovative “half-moon” base design
leaves tradition behind and saves weight, while achieving high performance to meet the needs of
Intel’s hottest new processor.
The standard heat sink comes with a 70,000 hour MTFB dual ball bearing fan, and ShinEtsu G-751
thermal interface material. Custom fans and interface are available on request.
*Intel and Pentium are registered trademarks of Intel Corporation
CoolFin™ Heat Sink with
Integrated Heat Pipes
37717
For use with Intel* Pentium*4
“Prescott” Processor Socket 478
Features and Benefits
■
Intel approved allows customers with limited
testing capability to specify part with
confidence
■
Meets Intel .330° C/W thermal resistance
target which ensures reliable system at any
usage level
■
At .275°C/W the 6000 RPM version offers
17% margin over Intel specification which
gives customer ability to scale up to higher
speed processor without upgrading heat sink
■
■
■
■
At 31 dB-A the medium speed version meets
thermal spec which offers excellent acoustics
for sensitive environments
Dual ball fan provides much higher
reliability than ball/sleeve, up to 70,000 hrs
MTBF
Low weight: 435 grams (Intel max spec.=
450g) applies less stress on socket or board
Easy to use, robust clip design is easy to
assemble, ensures proper application force
SPECIFICATIONS
Reference
Packaging: Tray/Box
Fan UL File No.: Various
Fan CSA File No : Various
Mates With: Socket 478
Designed In: mm
Electrical: 37717-0001
Fan min. starting Voltage: 4 VDC
Operational voltage range: 4–12.5 VDC
Current: .35A
Connector: Molex 3 Pin 2695-03-22-01-3037
Thermal Efficiency (°C/W)
37717-0001: .275 °C/W
Mechanical
Retention Clip mating Force: 55-65 lbs total
Physical
Weight: 435g
Fan size: 70x15mm
Fan bearing type: Dual ball
Heat sink: Copper base, Copper/Aluminum fins, Copper
heat pipes
Operating temp: 0 to + 85°C
Thermal Interface Material options:
ShinEtsu – G-751
Note: Custom interface or fan options available on
request.
APPLICATIONS
■
■
■
CoolFin™ Heat Sink with
Integrated Heat Pipes
37717
F
or use with Intel* Pentium*4
“Prescott” Processor Socket 478
Desktop
Workstation
Distribution: wherever tray processors are sold
ORDERING INFORMATION
Order No.
Fan Speed
RPM
CFM
Fan Noise
(dBA)
Power
(W)
T
CASE
(°C)
T
AMBIENT
(°C)
T
CASE-T0-AMBIENT
(°C)
T
CASE-T0-AMBIENT
(°C/W)
37717-0001
37717-1001
6000
3300
41.95
28.80
46.5
31.0
75.0
75.0
53.6
56.8
33.0
33.0
20.6
23.8
0.275
0.317
0.330
0.320
0.310
0.300
0.290
0.280
0.270
0.260
0.250
(°C/W)
CASE-TO-AMBIENT
46.5 dB-A
.275
°C/W
31.0 dB-A
45.0
40.0
35.0
30.0
25.0
20.0
Θ
37717-0001
Molex Order Number
Thermal Resistance
37717-1001
Fan Noise
*Thermal efficiency or thermal resistance, expressed as “Degrees Celsius per watt (°C/W)”, is an industry standard measure of heat sink performance.
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Fax:630-969-1352
Visit our Web sit e at www.mol ex.co m/h eatsin k.h tml
Order No. USA-221
Printed in USA/JI/2004.02
©
Fan Noise (dBA)
2004, Molex
.315
°C/W
50.0
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