05138
Only One Name Means ProTek’Tion™
SMF05C - SMF24C
MULTI-LINE TVS ARRAY
DESCRIPTIoN
The SMFxxC series are subminiature TVS suppressor arrays designed for the protection of sensitive IC components
from the damaging effects of Electrostatic Discharge (ESD) and Electrial Fast Transients (EFT). This series is ideally
suited for use in portable electronics such as SMART phones, laptops, as well as cellular phone base stations.
The SMFxxC series provides protection in accordance with IEC 61000-4-2 and IEC 61000-4-4 requirements. This series
is available in a SC70-6L package configuration and is rated at 100 Watts peak pulse power (8/20µs) per line.
SC70-6L PACkAGE
FEATURES
•
•
•
•
•
•
•
•
•
•
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
100 Watts Peak Pulse Power per Line(tp = 8/20µs)
Monolithic Design
Protects 4 Bidirectional Lines or 5 Unidirectional Lines
ESD Protection > 25 kilovolts
Available in Multiple Voltages
Low Clamping Voltage
RoHS Compliant
REACH Compliant
APPLICATIoNS
•
•
•
•
Notebook Computers
Cellular Phone Base Stations
SMART Phones
Digital Cameras
MEChANICAL ChARACTERISTICS
Molded JEDEC SC70-6L Package
Approximate Weight: 7milligrams
Lead-Free Pure-Tin Plating (Annealed)
Solder Reflow Temperature:
Pure-Tin - Sn, 100: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape and Reel per EIA Standard 481
•
•
•
•
PIN CoNFIGURATIoN
1
2
3
6
5
4
05138.R10 3/11
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05138
Only One Name Means ProTek’Tion™
SMF05C - SMF24C
TYPICAL DEVICE ChARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBoL
P
PP
T
L
T
STG
VALUE
100
-55 to 150
-55 to 150
UNITS
Watts
°C
°C
ELECTRICAL ChARACTERISTICS PER LINE
@ 25°C Unless otherwise Specified
PART
NUMBER
DEVICE
MARkING
RATED
STAND-oFF
VoLTAGE
V
wM
VoLTS
SMF05C
SMF12C
SMF15C
SMF24C
1. Pins 1, 3, 4, 5 or 6 to pin 2.
MINIMUM
BREAkDowN
VoLTAGE
@ 1mA
V
(BR)
VoLTS
6.0
13.3
16.7
26.7
MAXIMUM
CLAMPING
VoLTAGE
(Fig. 2)
@ I
P
= 5A
V
C
VoLTS
9.8
18.0
22.0
50.0
MAXIMUM
LEAkAGE
CURRENT
@V
wM
I
D
µA
5
1
1
1
MAXIMUM
CAPACITANCE
(Note 1)
@0V, 1Mhz
Cj
pF
60
30
25
20
05C
12C
15C
24C
5.0
12.0
15.0
24.0
NoTES
10,000
FIGURE 1
PEAk PULSE PowER VS PULSE TIME
P
PP
- Peak Pulse Power - watts
1,000
100W, 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
05138.R10 3/11
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05138
Only One Name Means ProTek’Tion™
SMF05C - SMF24C
TYPICAL DEVICE ChARACTERISTICS
FIGURE 2
PULSE wAVE FoRM
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
120
I
PP
- Peak Pulse Current - % of I
PP
100
80
% of Rated Power
FIGURE 3
PowER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
0
Average Power
t
d
= t/(I
PP
/2)
10
15
t - Time - µs
20
25
30
0
25
50
75 100 125
T
A
- Ambient Temperature - °C
150
FIGURE 4
TYPICAL CLAMPING VoLTAGE VS PEAk PULSE CURRENT SMF05C
13
V
C
- Clamping Voltage - Volts
9
5
1
0
2
4
6
I
PP
- Peak Pulse Current - Amps
8
10
05138.R10 3/11
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05138
Only One Name Means ProTek’Tion™
SMF05C - SMF24C
APPLICATIoN INFoRMATIoN
Line 1
Line 2
3
I/O Port
2
1
4
5
6
Line 3
Line 4
FIGURE 1 - CoMMoN-MoDE I/o PoRT PRoTECTIoN (UNIDIRECTIoNAL)
Circuit connectivity is as follows:
• Line 1 connected to pin 1.
• Line 2 connected to pin 3.
• Line 3 connected to pin 4.
• Line 4 connected to pin 6.
• Pin 2 connected to ground.
• Pin 5 not connected.
Line 1
Line 2
3
I/O Port
2
1
4
5
6
Line 3
Line 4
Line 5
FIGURE 2 - CoMMoN-MoDE I/o PoRT PRoTECTIoN (BIDIRECTIoNAL)
Circuit connectivity is as follows:
• Line 1 connected to pin 1.
• Line 2 connected to pin 3.
• Line 3 connected to pin 4.
• Line 4 connected to pin 5.
• Line 5 connected to pin 6.
• Pin 2 not connected.
CIRCUIT BoARD RECoMMENDATIoNS
Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:
• The protection device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
• The path length between the TVS device and the protected line should be minimized.
• All conductive loops including power and ground loops should be minimized.
• The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
• Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
05138.R10 3/11
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05138
Only One Name Means ProTek’Tion™
SMF05C - SMF24C
SC70-6L PACkAGE INFoRMATIoN
oUTLINE DIMENSIoNS
DIM
A
B
C
D
E
F
G
J
K
L
M
NoTES
0.80
0.08
2.00
-
0.26
D
E
MILLIMETERS
MIN
1.90
1.15
0.80
0.15
0.65 BSC
1.30 BSC
1.10
0.25
2.40
0.10
0.46
INChES
MIN
0.074
0.045
0.031
0.005
MAX
2.15
1.35
1.00
0.30
MAX
0.084
0.055
0.040
0.012
6
5
4
K
1
2
3
L
F
A
B
M
J
0° - 8°
0.026 BSC
0.051 BSC
0.031
0.003
0.078
-
0.010
0.043
0.010
0.095
0.004
0.018
C
G
1. Controlling dimension: inches.
2. Dimensioning and tolerances per ANSI Y14.5M, 1985.
3. Dimensions are exclusive of mold flash and metal burrs.
PAD LAYoUT DIMENSIoNS
DIM
A
B
C
D
E
NoTES
B
C
E
D
MILLIMETERS
NoMINAL
0.50
1.30
0.65
1.72
0.60
INChES
NoMINAL
0.020
0.051
0.026
0.068
0.024
A
1. Controlling dimension: inches.
05138.R10 3/11
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