Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
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Rectangular
Connectors
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2
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Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
—
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
—
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
—
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
—
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
(Continued)
No. of Cavities
Single Bay
38
78
120
152
200
Double Bay
304
400
4.600
116.84
5.800
147.32
4.440
112.78
5.640
143.26
1.900
48.26
2.500
63.50
.925
23.50
1.225
31.12
A Dim.
1.000
25.40
1.500
38.10
2.050
52.07
2.450
62.23
3.050
77.47
B Dim.
.840
21.34
1.340
34.04
1.890
48.01
2.290
58.17
2.890
73.41
C Dim.
.450
11.43
.950
24.13
1.500
38.10
1.900
48.26
2.500
63.50
D Dim.
—
—
.725
18.42
.925
23.50
1.225
31.12
How To Specify
S — Solder pot
Z — Coke Bottle Termination (Receptacle only, see Table I)
ZA — 4 Row Wire Termination (Plug only)
ZB — 8 Row Wire Termination (Plug only)
X — Special Wire and/or other than above
HDSM
Connector Series
Contact Location
1 — Full complement of contacts
2 — Contacts in outside row only
3 — Contacts in inside row only
4 — Other than above or special housing
1
152
L
4
L
4
0.5
Wire Length
Wire Color/Finish
1 — All white
2 — All yellow
3 — All gray
4 — Gold plated
5 — Tin dipped gold plated
6 — Bare (unfinished)
7 — Color coded per MIL-STD-681,
System 1
8 — Special color code
9 — Ten basic color repeating on
each row (A, B, C, D)
(starting with black)
Layout
38, 78, 120, 152, 200, 304 & 400
Contact Type
L — Low Force Pin
SL — Low Force Socket
Wire Type
*A — Type E, 7 strand
*B — Type ET, 7 strand
*C — Type E, 19 strand
6—26 AWG
8—28 AWG
0—30 AWG
*Per MIL-W-16878
*D — Type ET, 19 strand
F — 7 strand per MIL-W-22759/11
(#28 AWG only)
G — 19 strand per MIL-W-22759/11
26 AWG, 24 AWG
L — Copper, solid
Q — Stranded per MIL-W-22759/33
Wire Size
4—24 AWG
5—25 AWG
Table I
Dash No.
1
2
3
4
Gap Between
Bushing "E"
.100
2.54
.093
2.36
.118
2.99
.145
3.68
F Dim.
.120
3.05
.060
1.52
.235
5.97
.120
3.05
G Dim.
.180
4.57
.150
3.81
.260
6.60
.180
4.57
H Dim.
(Ref.)
.330
8.38
.330
8.38
.483
12.27
.330
8.38
54
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
FPGA/CPLD
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