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Datasheet> 器件分类 > 存储> 存储> UPD44322162F1-A50-FQ2

UPD44322162F1-A50-FQ2: 产品描述Cache SRAM, 2MX16, 3.1ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165; 产品类别存储存储; 文件大小393KB，共40页; 制造商NEC(日电)

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UPD44322162F1-A50-FQ2概述

Cache SRAM, 2MX16, 3.1ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165

UPD44322162F1-A50-FQ2规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
零件包装代码	BGA
包装说明	LBGA,
针数	165
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	3.1 ns
其他特性	PIPELINED ARCHITECTURE
JESD-30 代码	R-PBGA-B165
JESD-609代码	e0
长度	17 mm
内存密度	33554432 bit
内存集成电路类型	CACHE SRAM
内存宽度	16
功能数量	1
端子数量	165
字数	2097152 words
字数代码	2000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	2MX16
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
座面最大高度	1.4 mm
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	15 mm
Base Number Matches	1

UPD44322162F1-A50-FQ2相似产品对比

	UPD44322162F1-A50-FQ2	UPD44322162F1-C60-FQ2	UPD44322162F1-C50-FQ2	UPD44322162F1-A60-FQ2	UPD44322162GF-C60	UPD44322162GF-A44	UPD44322162GF-A50	UPD44322162GF-C50	UPD44322162GF-A60	UPD44322162F1-A44-FQ2
描述	Cache SRAM, 2MX16, 3.1ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165	Cache SRAM, 2MX16, 3.5ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165	Cache SRAM, 2MX16, 3.1ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165	Cache SRAM, 2MX16, 3.5ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165	Cache SRAM, 2MX16, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100	Cache SRAM, 2MX16, 2.8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100	Cache SRAM, 2MX16, 3.1ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100	Cache SRAM, 2MX16, 3.1ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100	Cache SRAM, 2MX16, 3.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100	Cache SRAM, 2MX16, 2.8ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	BGA	QFP	QFP	QFP	QFP	QFP	BGA
包装说明	LBGA,	LBGA,	LBGA,	15 X 17 MM, PLASTIC, FBGA-165	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LBGA,
针数	165	165	165	165	100	100	100	100	100	165
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	3.1 ns	3.5 ns	3.1 ns	3.5 ns	3.5 ns	2.8 ns	3.1 ns	3.1 ns	3.5 ns	2.8 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 代码	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B165
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	17 mm	17 mm	17 mm	17 mm	20 mm	20 mm	20 mm	20 mm	20 mm	17 mm
内存密度	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	165	165	165	165	100	100	100	100	100	165
字数	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
字数代码	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LBGA	LBGA	LBGA	LBGA	LQFP	LQFP	LQFP	LQFP	LQFP	LBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.4 mm
最大供电电压 (Vsup)	3.465 V	2.625 V	2.625 V	3.465 V	2.625 V	3.465 V	3.465 V	2.625 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	2.375 V	2.375 V	3.135 V	2.375 V	3.135 V	3.135 V	2.375 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	2.5 V	2.5 V	3.3 V	2.5 V	3.3 V	3.3 V	2.5 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	BALL	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	15 mm	15 mm	15 mm	15 mm	14 mm	14 mm	14 mm	14 mm	14 mm	15 mm
厂商名称	-	-	-	-	NEC(日电)	NEC(日电)	NEC(日电)	NEC(日电)	NEC(日电)	NEC(日电)

UPD44322162F1-A50-FQ2

UPD44322162F1-A50-FQ2概述

UPD44322162F1-A50-FQ2规格参数

UPD44322162F1-A50-FQ2相似产品对比

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