Fixed-Point Digital Signal Processor 384-FCBGA
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 零件包装代码 | BGA |
| 包装说明 | HFBGA, BGA384,22X22,32 |
| 针数 | 384 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 22 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 300 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B384 |
| 长度 | 18 mm |
| 低功率模式 | YES |
| 端子数量 | 384 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HFBGA |
| 封装等效代码 | BGA384,22X22,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| 电源 | 1.5,3.3 V |
| 认证状态 | Not Qualified |
| RAM(字数) | 524288 |
| 座面最大高度 | 2.8 mm |
| 最大供电电压 | 1.57 V |
| 最小供电电压 | 1.43 V |
| 标称供电电压 | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 宽度 | 18 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C6203BGLSH | TMS320C6203BGLS-3H | TMS320C6203BZNZ173 | |
|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 384-FCBGA | Fixed-Point Digital Signal Processor 384-FCBGA | Fixed-Point Digital Signal Processor 352-FCBGA |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 |
| 包装说明 | HFBGA, BGA384,22X22,32 | HFBGA, BGA384,22X22,32 | BGA, BGA352,26X26,40 |
| Reach Compliance Code | unknown | not_compliant | unknow |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 22 | 22 | 22 |
| 桶式移位器 | NO | NO | NO |
| 位大小 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES |
| 最大时钟频率 | 300 MHz | 300 MHz | 300 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B384 | S-PBGA-B384 | S-PBGA-B352 |
| 长度 | 18 mm | 18 mm | 27 mm |
| 低功率模式 | YES | YES | YES |
| 端子数量 | 384 | 384 | 352 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HFBGA | HFBGA | BGA |
| 封装等效代码 | BGA384,22X22,32 | BGA384,22X22,32 | BGA352,26X26,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY |
| 电源 | 1.5,3.3 V | 1.5,3.3 V | 1.7,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| RAM(字数) | 524288 | 524288 | 131072 |
| 座面最大高度 | 2.8 mm | 2.8 mm | 2.8 mm |
| 最大供电电压 | 1.57 V | 1.57 V | 1.57 V |
| 最小供电电压 | 1.43 V | 1.43 V | 1.43 V |
| 标称供电电压 | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 18 mm | 18 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 零件包装代码 | BGA | BGA | - |
| 针数 | 384 | 384 | - |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | - |
| Base Number Matches | 1 | 1 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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