Microprogram Sequencer, 4-Bit, TTL, 0.133 X 0.200 INCH, DIE-29
| 参数名称 | 属性值 |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| 针数 | 29 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 外部数据总线宽度 | 4 |
| JESD-30 代码 | R-XUUC-N29 |
| 端子数量 | 29 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 认证状态 | Not Qualified |
| 最大压摆率 | 239 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 |
| AM2930XM | AM2930DC | AM2930DCB | AM2930DMB | AM2930FMB | AM2930XC | AM2930LC | AM2930LMB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microprogram Sequencer, 4-Bit, TTL, 0.133 X 0.200 INCH, DIE-29 | Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28 | Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28 | Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28 | Microprogram Sequencer, 4-Bit, TTL, PDFP28, FP-28 | Microprogram Sequencer, 4-Bit, TTL, 0.133 X 0.200 INCH, DIE-29 | Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28 | Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28 |
| 零件包装代码 | DIE | DIP | DIP | DIP | DFP | DIE | QLCC | QLCC |
| 包装说明 | DIE, | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DFP, FL28,.4 | DIE, DIE OR CHIP | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ |
| 针数 | 29 | 28 | 28 | 28 | 28 | 29 | 28 | 28 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknown | unknown | unknown |
| 外部数据总线宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| JESD-30 代码 | R-XUUC-N29 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PDFP-F28 | R-XUUC-N29 | S-CQCC-N28 | S-CQCC-N28 |
| 端子数量 | 29 | 28 | 28 | 28 | 28 | 29 | 28 | 28 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIE | DIP | DIP | DIP | DFP | DIE | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE | FLATPACK | UNCASED CHIP | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 239 mA | 220 mA | 220 mA | 239 mA | 239 mA | 220 mA | 220 mA | 239 mA |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL | UPPER | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 长度 | - | 37.211 mm | 37.211 mm | 37.211 mm | 17.9705 mm | - | 8.89 mm | 8.89 mm |
| 封装等效代码 | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | FL28,.4 | DIE OR CHIP | LCC28,.45SQ | LCC28,.45SQ |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | - | 5.715 mm | 5.715 mm | 5.715 mm | 2.921 mm | - | 2.54 mm | 2.54 mm |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 15.24 mm | 15.24 mm | 15.24 mm | 16.256 mm | - | 8.89 mm | 8.89 mm |
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