BCT/FBT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP24
| 参数名称 | 属性值 |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | WITH CLEAR AND CLOCK ENABLE; WITH TRIPLE OUTPUT ENABLE |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 32.005 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 40 mA |
| 传播延迟（tpd） | 9.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SNJ54BCT29826JT | SN54BCT29826JT | SNJ54BCT29826W | SNJ54BCT29826FK | |
|---|---|---|---|---|
| 描述 | BCT/FBT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP24 | BCT/FBT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP24 | BCT/FBT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP24 | BCT/FBT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC28 |
| 包装说明 | DIP, | DIP, DIP24,.3 | DFP, | QCCN, |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown |
| 其他特性 | WITH CLEAR AND CLOCK ENABLE; WITH TRIPLE OUTPUT ENABLE | WITH CLEAR AND CLOCK ENABLE; WITH TRIPLE OUTPUT ENABLE | WITH CLEAR AND CLOCK ENABLE; WITH TRIPLE OUTPUT ENABLE | WITH CLEAR AND CLOCK ENABLE; WITH TRIPLE OUTPUT ENABLE |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-GDFP-F24 | S-CQCC-N28 |
| 长度 | 32.005 mm | 32.005 mm | 14.36 mm | 11.43 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DFP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| 最大电源电流（ICC） | 40 mA | 40 mA | 40 mA | 40 mA |
| 传播延迟（tpd） | 9.4 ns | 9.4 ns | 9.4 ns | 9.4 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.29 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 9.09 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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