ZMD-Standard
February 2004
Package TSOP32 (I/8x13,4)
MDS
768
Dimensions in millimetres
1 Dimensions
Detail
Z
Z
A
2
0,1
A
A
1
1
32
e
D
H
D
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Dmin
H
Dmax
L
Pmin
1,20
0,17
0,27
0,50
13,20
13,60
0,50
b
p
0,1
M
E
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min*
−
0,05
0,15
0,90
1,05
0,10
0,21
11,70
11,90
7,90
8,10
0°
5°
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
≤
0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
D
max
*
E
min*
E
max
*
θ
min
θ
max
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Check: signed Marx
Date: 18.02.2004
Quality: signed Tina Kochan
Doc-No.
QS-000768-HD-01
c
L
P
θ