ZMD-Standard
March 1997
1. Amendment November 1997
Package SOP32
(300 mil)
MDS
745
Dimensions in millimetres
Based on JEDEC: JEP95 MO-119
1 Dimensions
A
2
A
X
View X
0,1
k x 45
32
A
1
1
Z
e
D
b
p
0,2
M
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Emin
H
Emax
L
Pmin
Z
max
2,54
0,36
0,51
1,27
10,29
10,64
0,53
0,91
H
E
E
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
*
D
max
*
2,29
0,102
0,254
2,18
2,29
0,15
0,32
20,57
20,88
7,42
7,60
0,25
0
8
* without mold-flash
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
0,91 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
E
min
*
E
max
*
k
min
°
min
°
max
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Check: signed Marx
Date: 27.03.1997
Quality: signed Lorenz
Doc-No.
QS-000745-HD-01
c
L
P
°
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