D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
CY7C1059DV33
8-Mbit (1M x 8) Static RAM
Features
■
Functional Description
The CY7C1059DV33
[1]
is a high performance CMOS Static RAM
organized as 1M words by 8 bits. Easy memory expansion is
provided by an active LOW Chip Enable (CE), an active LOW
Output Enable (OE), and tri-state drivers. To write to the device,
take Chip Enable (CE) and Write Enable (WE) inputs LOW. Data
on the eight IO pins (IO
0
through IO
7
) is then written into the
location specified on the address pins (A
0
through A
19
).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under
these conditions, the contents of the memory location specified
by the address pins appear on the IO pins.
The eight input or output pins (IO
0
through IO
7
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), or a write operation is in
progress (CE LOW and WE LOW).
The CY7C1059DV33 is available in 36-ball FBGA and 44-pin
TSOP II packages with center power and ground (revolutionary)
pinout.
High speed
❐
t
AA
= 10 ns
Low active power
❐
I
CC
= 110 mA at 10 ns
Low CMOS standby power
❐
I
SB2
= 20 mA
2.0V data retention
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 44-pin TSOP II package
Offered in standard and high reliability (Q) grades
■
■
■
■
■
■
■
■
Logic Block Diagram
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
CE
WE
OE
INPUT BUFFER
ROW DECODER
IO0
IO1
SENSE AMPS
IO2
IO3
IO4
IO5
IO6
1M x 8
ARRAY
COLUMN DECODER
POWER
DOWN
IO7
Note
1. For guidelines about SRAM system design, refer to the Cypress application note
AN1064, SRAM System Guidelines
available at
www.cypress.com.
A11
A12
A13
A14
A15
A16
A17
A18
A19
Cypress Semiconductor Corporation
Document #: 001-00061 Rev. *E
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised September 16, 2009
[+] Feedback
CY7C1059DV33
Pin Configuration
Figure 1. 44-Pin TSOP II
Top View
NC
NC
A
0
A
1
A
2
A
3
A
4
CE
IO
0
IO
1
V
CC
V
SS
IO
2
IO
3
WE
A
5
A
6
A
7
A
8
A
9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A
18
A
17
A
16
A
15
OE
IO
7
IO
6
V
SS
V
CC
IO
5
IO
4
A
14
A
13
A
12
A
11
A
10
A
19
NC
NC
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
–10
10
110
20
–12
12
100
20
Unit
ns
mA
mA
Document #: 001-00061 Rev. *E
Page 2 of 10
[+] Feedback
CY7C1059DV33
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[2]
....–0.5V to + 4.6V
DC Voltage Applied to Outputs
in High-Z State
[2]
.................................... –0.3V to V
CC
+ 0.3V
DC Input Voltage
[2]
................................ –0.3V to V
CC
+ 0.3V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage............. ...............................>2001V
(MIL-STD-883, Method 3015)
Latch up Current...................................................... >200 mA
Operating Range
Range
Industrial
Ambient Temperature
–40°C to +85°C
V
CC
3.3V
±
0.3V
Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
I
SB1
I
SB2
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
[2]
Input Leakage Current
Output Leakage Current
V
CC
Operating
Supply Current
Automatic CE Power Down
Current —TTL Inputs
Automatic CE Power Down
Current —CMOS Inputs
GND < V
I
< V
CC
GND < V
OUT
< V
CC
, Output Disabled
V
CC
= Max., f = f
MAX
= 1/t
RC
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
Max. V
CC
, CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V, or V
IN
< 0.3V, f = 0
Test Conditions
V
CC
= Min., I
OH
= –4.0 mA
V
CC
= Min., I
OL
= 8.0 mA
2.0
–0.3
–1
–1
–10
Min
2.4
0.4
V
CC
+ 0.3
0.8
+1
+1
110
40
20
2.0
–0.3
–1
–1
Max
Min
2.4
0.4
V
CC
+ 0.3
0.8
+1
+1
100
35
20
–12
Max
Unit
V
V
V
V
μA
μA
mA
mA
mA
Capacitance
Tested initially and after any design or process changes that may affect these parameters
.
]
Parameter
C
IN
C
OUT
Description
Input Capacitance
IO Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
CC
= 3.3V
Max
12
12
Unit
pF
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Θ
JA
Θ
JC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch, four-layer printed
circuit board
TSOP II
51.43
15.8
Unit
°C/W
°C/W
Notes
2. V
IL(min)
= –2.0V and V
IH(max)
= V
CC
+ 2V for pulse durations of less than 20 ns.
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-00061 Rev. *E
Page 3 of 10
[+] Feedback
CY7C1059DV33
AC Test Loads and Waveforms
AC characteristics (except High-Z) are tested using the load conditions shown in
Figure 2
(a). High-Z characteristics are tested for all
speeds using the test load shown in
Figure 2
(c).
Figure 2. AC Test Loads and Waveforms
Z = 50Ω
OUTPUT
50Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
3.0V
30 pF*
GND
ALL INPUT PULSES
90%
10%
90%
10%
1.5V
(a)
Rise Time: 1 V/ns
R 317Ω
(b)
Fall Time: 1 V/ns
High-Z characteristics:
3.3V
OUTPUT
5 pF
(c)
R2
351Ω
Data Retention Characteristics
Over the Operating Range
Parameter
V
DR
I
CCDR
t
CDR[3]
t
R[5]
Description
V
CC
for Data Retention
Data Retention Current
Chip Deselect to Data
Retention Time
Operation Recovery Time
Figure 3. Data Retention Waveform
DATA RETENTION MODE
V
CC
CE
3.0V
t
CDR
V
DR
>
2V
3.0V
t
R
Conditions
[4]
V
CC
= V
DR
= 2.0V, CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V or V
IN
< 0.3V
Min
2.0
Max
20
Unit
V
mA
ns
ns
0
t
RC
Notes
4. No inputs may exceed V
CC
+ 0.3V.
5. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 50
μs
or stable at V
CC(min)
> 50
μs.
Document #: 001-00061 Rev. *E
Page 4 of 10
[+] Feedback