1 Func, 0.2MHz, BIPolar, PDIP14, 0.300 INCH, PLASTIC, DIP-14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP14,.3 |
针数 | 14 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
长度 | 19.305 mm |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
最大输出频率 | 0.2 GHz |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE |
电源 | +-5,+-15 V |
认证状态 | Not Qualified |
座面最大高度 | 5.33 mm |
最大供电电压 (Vsup) | 30 V |
最小供电电压 (Vsup) | 10 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE |
宽度 | 7.62 mm |
Base Number Matches | 1 |
XR-8038ACP | XR-8038AM | XR-8038AN | XR-8038AP | XR-8038ACN | |
---|---|---|---|---|---|
描述 | 1 Func, 0.2MHz, BIPolar, PDIP14, 0.300 INCH, PLASTIC, DIP-14 | 1 Func, 0.2MHz, BIPolar, CDIP14, CERAMIC, DIP-14 | 1 Func, 0.2MHz, BIPolar, CDIP14, CERAMIC, DIP-14 | 1 Func, 0.2MHz, BIPolar, PDIP14, PLASTIC, DIP-14 | 1 Func, 0.2MHz, BIPolar, CDIP14, CERAMIC, DIP-14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
针数 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE |
JESD-30 代码 | R-PDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | R-GDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 19.305 mm | 19.5453 mm | 19.5453 mm | 19.304 mm | 19.5453 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C |
最大输出频率 | 0.2 GHz | 0.2 GHz | 0.2 GHz | 0.2 GHz | 0.2 GHz |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.33 mm | 5.08 mm | 5.08 mm | 5.334 mm | 5.08 mm |
最大供电电压 (Vsup) | 30 V | 30 V | 30 V | 30 V | 30 V |
最小供电电压 (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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