32-BIT, 33.33 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFP |
包装说明 | FQFP, |
针数 | 208 |
Reach Compliance Code | unknown |
地址总线宽度 | 24 |
桶式移位器 | YES |
边界扫描 | YES |
最大时钟频率 | 33.33 MHz |
外部数据总线宽度 | 32 |
格式 | FLOATING POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e3 |
长度 | 28 mm |
低功率模式 | NO |
湿度敏感等级 | 3 |
端子数量 | 208 |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | COMMERCIAL |
座面最大高度 | 4.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3.13 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 28 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches | 1 |
ADSP-21065LKSZ-264 | ADSP-21065LCSZ-240 | ADSP-21065LKSZ-240 | ADSP-21065LKCAZ-240 | ADSP-21065LKCA-264 | ADSP-21065LCCAZ-240 | ADSP-21065LKS-240 | ADSP-21065LKS-264 | |
---|---|---|---|---|---|---|---|---|
描述 | 32-BIT, 33.33 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208 | 32-BIT, 30 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208 | 32-BIT, 30 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208 | 32-BIT, 30 MHz, OTHER DSP, PBGA196, CHIP SCALE, MS-034AAE-1, BGA-196 | 32-BIT, 33.33 MHz, OTHER DSP, PBGA196, CHIP SCALE, MS-034AAE-1, BGA-196 | 32-BIT, 30 MHz, OTHER DSP, PBGA196, CHIP SCALE, MS-034AAE-1, BGA-196 | 32-BIT, 30 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208 | 32-BIT, 33.33 MHz, OTHER DSP, PQFP208, MS-029FA-1, MQFP-208 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
零件包装代码 | QFP | QFP | QFP | BGA | BGA | BGA | QFP | QFP |
包装说明 | FQFP, | FQFP, | FQFP, | BGA, | BGA, | BGA, | FQFP, | FQFP, |
针数 | 208 | 208 | 208 | 196 | 196 | 196 | 208 | 208 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
地址总线宽度 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
桶式移位器 | YES | YES | YES | YES | YES | YES | YES | YES |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 33.33 MHz | 30 MHz | 30 MHz | 30 MHz | 33.33 MHz | 30 MHz | 30 MHz | 33.33 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PQFP-G208 | S-PQFP-G208 |
长度 | 28 mm | 28 mm | 28 mm | 15 mm | 15 mm | 15 mm | 28 mm | 28 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
湿度敏感等级 | 3 | 3 | 3 | NOT SPECIFIED | 3 | NOT SPECIFIED | 3 | 3 |
端子数量 | 208 | 208 | 208 | 196 | 196 | 196 | 208 | 208 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FQFP | FQFP | FQFP | BGA | BGA | BGA | FQFP | FQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | 240 | NOT SPECIFIED | 240 | 240 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 4.1 mm | 4.1 mm | 4.1 mm | 1.9 mm | 1.9 mm | 1.9 mm | 4.1 mm | 4.1 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | NOT SPECIFIED | TIN LEAD SILVER | NOT SPECIFIED | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | 30 |
宽度 | 28 mm | 28 mm | 28 mm | 15 mm | 15 mm | 15 mm | 28 mm | 28 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
JESD-609代码 | e3 | e3 | e3 | - | e0 | - | e0 | e0 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
温度等级 | OTHER | - | OTHER | OTHER | OTHER | - | OTHER | OTHER |
厂商名称 | - | Rochester Electronics | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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