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GS8672Q18AE-333T

产品描述Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165
产品类别存储    存储   
文件大小814KB,共27页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
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GS8672Q18AE-333T概述

Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165

GS8672Q18AE-333T规格参数

参数名称属性值
零件包装代码BGA
包装说明LBGA,
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间0.45 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
长度17 mm
内存密度75497472 bit
内存集成电路类型STANDARD SRAM
内存宽度18
功能数量1
端子数量165
字数4194304 words
字数代码4000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度15 mm
Base Number Matches1

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Preliminary
GS8672Q18/36AE-333/300/250/200
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• On-Chip ECC with virtually zero SER
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write Capability
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 9Mb, 18Mb, and 36Mb and
144Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
72Mb SigmaQuad-II™
Burst of 2 ECCRAM™
Clocking and Addressing Schemes
333 MHz–200 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
The GS8672Q18/36AE SigmaQuad-II ECCRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
High, the K clocks are routed internally to fire the output
registers instead.
Because Separate I/O SigmaQuad-II B2
ΕCCRAMs
always
transfer data in two packets, A0 is internally set to 0 for the
first read or write transfer, and automatically incremented by 1
for the next transfer. Because the LSB is tied off internally, the
address field of a SigmaQuad-II B2 ECCRAM is always one
address pin less than the advertised index depth (e.g., the 4M x
18 has a 2048K addressable index).
SigmaQuad™ ECCRAM Overview
The GS8672Q18/36AE SigmaQuad-II ECCRAMs are built in
compliance with the SigmaQuad-II SRAM pinout standard for
Separate I/O synchronous SRAMs. They are 75,497,472-bit
(72Mb) ECCRAMs. The GS8672Q18/36AE SigmaQuad-II
ECCRAMs are just one element in a family of Low power,
Low voltage HSTL I/O ECCRAMs designed to operate at the
speeds needed to implement economical High performance
networking systems.
On-Chip Error Correction Code
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by Soft Error Rate (SER) events such as cosmic rays,
alpha particles. The resulting SER of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no On-Chip ECC,
which typically have an SER of 200 FITs/Mb or more. SER
quoted above is based on reading taken at sea level.
However, the On-Chip Error Correction (ECC) will be
disabled if a “Half Write” operation is initiated. See the
Byte
Write Contol
section for further information.
Parameter Synopsis
-333
tKHKH
tKHQV
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
Rev: 1.02 5/2010
1/27
© 2010, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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