FERROXCUBE
DATA SH
EET
A SHEET
SMD common mode chokes
EMI-suppression products
Supersedes data of February 2002
2004 Sep 01
Ferroxcube
EMI-suppression products
SMD COMMON MODE CHOKES FOR
EMI-SUPPRESSION
General data
ITEM
Strip
material
Solderability
Taping
method
SPECIFICATION
copper (Cu), tin-lead (SnPb) plated,
lead-free (Sn) available on request.
SMD common mode chokes
GRADE
|Z
typ
|
(1)
at f
(Ω)
(MHz)
TYPE NUMBER
CMS4-11/3/4.8; mass
≈0.6
g
4S2
inner
channel
4S2
outer
channel
12
23
42
15
30
50
25
100
300
25
100
300
CMS4-11/3/4.8-4S2
“IEC 60068-2-58”,
Part 2, Test Ta,
method 1
“IEC 60286-3”
,
“EIA 481-1-A”
and
“EIA 481-2”
CMS4-11/3/8.9; mass
≈1.1
g
Grades, parameters and type numbers
GRADE
|Z
typ
|
(1)
at f
(Ω)
(MHz)
TYPE NUMBER
4S2
inner
channel
4S2
outer
channel
Note
1. Typical values, Z
min
is
−20%.
DC resistance
<0.6
mΩ.
23
45
82
27
58
97
25
100
300
25
100
300
CMS4-11/3/8.9-4S2
CMS2-5.6/3/4.8; mass
≈0.3
g
4S2
21
35
50
25
100
300
CMS2-5.6/3/4.8-4S2
CMS2-5.6/3/8.9; mass
≈0.6
g
4S2
38
60
Mechanical data
25
100
CMS2-5.6/3/8.9-4S2
8.9
−0.5
>5
handbook, halfpage
4.75
±0.3
>1.2
handbook, halfpage
>1.1
>1.2
1.33
±0.2
1.27
±0.07
3.04
max.
3.04
max.
CBW180
0.2
0.2
5.6
±0.2
a. CMS2-5.6/3/8.9 (side view).
Dimensions in mm.
b. CMS2-5.6/3/4.8 (side view).
Front view (a and b).
Fig.1 CMS2-5.6/3/4.8 and CMS2-5.6/3/8.9.
2004 Sep 01
2
Ferroxcube
EMI-suppression products
SMD common mode chokes
8.9
−0.5
>5
handbook, halfpage
handbook, full pagewidth
4.75
±0.3
>1.2
>1.1
>1.2
1.33
±0.2
1.27
±0.07
3.04
max.
3.04
max.
CBW181
0.2
0.2
10.8
±0.3
a. CMS4-11/3/8.9 (side view).
Dimensions in mm.
b. CMS4-11/3/4.8 (side view).
Front view (a and b).
Fig.2 CMS4-11/3/4.8 and CMS4-11/3/8.9.
Recommended dimensions of solder lands
handbook, halfpage
2.5
;;
;;
;;
;;
1.8
6.4
2.8
;;
;;
;;
;;
MBG063
handbook, halfpage
6.4
1.9
2.5
;;;;;
;;
;;;;;
;;
;;;;;
;;
;;;;;
;;
1.8
2.0
0.8
1.9
MBG064
Dimensions in mm.
Dimensions of solder lands are based on a solder paste layer
thickness of approximately 200
µm
(≈0.7 mg solder paste per mm
2
).
Dimensions in mm.
Fig.3
Solder lands for reflow soldering of
CMS2-5.6/3/4.8.
Fig.4
Solder lands for wave
soldering of CMS2-5.6/3/4.8.
2004 Sep 01
3
Ferroxcube
EMI-suppression products
SMD common mode chokes
handbook, halfpage
2.5
;
;
;
1.8
10.8
7.0
;;
;;
;;
1.9
CBW291
handbook, halfpage
2.5
;;;;;
;;;;;
;;;;;
10.8
6.0
1.8
2.5
1.9
CBW292
Dimensions in mm.
Dimensions of solder lands are based on a solder paste layer
thickness of approximately 200
µm
(≈0.7 mg solder paste per mm
2
).
Dimensions in mm.
Fig.5
Solder lands for reflow soldering of
CMS2-5.6/3/8.9.
Fig.6
Solder lands for wave
soldering of CMS2-5.6/3/8.9.
handbook, halfpage
2.5
;;
;;
;;
;;
;;
;;
;;
1.8
6.4
2.8
;;
;;
;;
;;
;;
;;
;;
MBG065
handbook, halfpage
1.9
2.5
;;;;;
;;
;;;;;
;;
;;;;;
;;
;;;;;
;;
;;;;;
;;
;;;;;
;;
;;;;;
;;
1.8
2.0
0.8
1.9
MBG066
6.4
Dimensions in mm.
Dimensions of solder lands are based on a solder paste layer
thickness of approximately 200
µm
(≈0.7 mg solder paste per mm
2
).
Dimensions in mm.
Fig.7
Solder lands for reflow soldering of
CMS4-11/3/4.8.
4
Fig.8
Solder lands for wave
soldering of CMS4-11/3/4.8.
2004 Sep 01
Ferroxcube
EMI-suppression products
SMD common mode chokes
handbook, halfpage
2.5
;
;
;
;
;
1.8
10.8
7.0
;;
;;
;;
;;
;;
1.9
CBW289
handbook, halfpage
2.5
;;;;;
;;;;;
;;;;;
;;;;;
;;;;;
10.8
6.0
1.8
2.5
1.9
CBW290
Dimensions in mm.
Dimensions of solder lands are based on a solder paste layer
thickness of approximately 200
µm
(≈0.7 mg solder paste per mm
2
).
Dimensions in mm.
Fig.9
Solder lands for reflow soldering of
CMS4-11/3/8.9.
Fig.10 Solder lands for wave
soldering of CMS4-11/3/8.9.
2004 Sep 01
5
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