F-213
®
(0,635 mm) .025"
HDLSP SERIES
I/O SYSTEM
HDLSP–035–1000
HIGH DENSITY/HIGH SPEED CABLE SYSTEM
SPECIFICATIONS
i
For complete specifications and
recommended PCB layouts see
www.samtec.com?HDLSP
Cable:
32 AWG low skew
pair cable
Insulator Material:
LCP
Terminal Material:
Phosphor Bronze
Jacket Material:
PVC
Insulator:
Dielectric
Conductors:
Copper
Braid:
Tinned Copper
Covers:
Diecast Zinc Alloy
Mates with:
HDI6
32 AWG low skew
pair cable
Industry’s densest
I/O cable system
APPLICATION
For HT3.1 see
www.samtec.com/ht3
and specify part number
HDR-149112-XXXX.
Designed
for heavy
duty handling
12 pairs
per side
48 pairs in 28 mm x 14 mm
panel opening
TYPE
NO. OF
POSITIONS
LENGTH
–035
HDLSP
= High Density
Low Skew Pair Cable
(Per Row)
= 12 Pairs per side
–“XXXX”
= Length in millimeters
–1000, –2000
(Contact Samtec for
other lengths)
(35,13) 1.383
A1
B1
(25,50) (22,85)
1.004
.900
A35
B35
(6,10)
.240
Supplied with
dust caps
(4,58)
.180
LENGTH
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
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