3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C
| 参数名称 | 属性值 |
| Brand Name | Intersil |
| 零件包装代码 | TQFN |
| 包装说明 | HVQCCN, LCC16,.16SQ,25 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N16 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 湿度敏感等级 | 3 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.16SQ,25 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 7.5 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| Base Number Matches | 1 |
| ISL9305IRTHAANLZ-T | ISL9305IRTHWCLBZ-T | ISL9305IRTHBCNLZ-T | ISL9305IRTHBFNCZ-T | ISL9305IRTHWCNYZ-T | ISL9305IRTHWCNLZ-T | ISL9305IRTHWLNCZ-T | |
|---|---|---|---|---|---|---|---|
| 描述 | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C | 3MHz Dual 1.5A Step-Down Converters and Dual Low-Input LDOs with I2C Compatible Interface; TQFN16; Temp Range: -40° to 85°C |
| Brand Name | Intersil | Intersil | Intersil | Intersil | Intersil | Intersil | Intersil |
| 零件包装代码 | TQFN | TQFN | TQFN | TQFN | TQFN | TQFN | TQFN |
| 包装说明 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.16SQ,25 | LCC16,.16SQ,25 | LCC16,.16SQ,25 | LCC16,.16SQ,25 | LCC16,.16SQ,25 | LCC16,.16SQ,25 | LCC16,.16SQ,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电流 (Isup) | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| Factory Lead Time | - | 17 weeks | 17 weeks | 17 weeks | 6 weeks | 17 weeks | 17 weeks |
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