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TSX68C000ME8A

产品描述Microprocessor, 32-Bit, 8MHz, HCMOS, CQCC68, CERAMIC, LCC-68
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小902KB,共54页
制造商e2v technologies
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TSX68C000ME8A概述

Microprocessor, 32-Bit, 8MHz, HCMOS, CQCC68, CERAMIC, LCC-68

TSX68C000ME8A规格参数

参数名称属性值
零件包装代码LCC
包装说明HQCCN,
针数68
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
地址总线宽度24
位大小32
边界扫描NO
最大时钟频率8 MHz
外部数据总线宽度16
格式FIXED POINT
集成缓存NO
JESD-30 代码S-CQCC-N68
长度24.13 mm
低功率模式NO
端子数量68
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码HQCCN
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG
认证状态Not Qualified
速度8 MHz
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术HCMOS
温度等级MILITARY
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度24.13 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR
Base Number Matches1

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TS68C000
Low Power HCMOS 16-/32-bit
Hi-Rel Microprocessor
Datasheet
Features
16-/32-bit Data and Address Register
16-Mbyte Direct Addressing Range
56 Powerful Instruction Types
Operations on Five Main Data Types
Memory Mapped Input/Output
14 Addressing Modes
Three Available Versions: 8 MHz/10 MHz and 12.5 MHz
Military Temperature Range: -55/+125°C
Power Supply: 5V
DC
± 10%
Description
The TS68C000 reduced power consumption device dissipates an order of magnitude less power than the HMOS TS68000.
The TS68C000 is an implementation of the TS68000 16/32 microprocessor architecture. The TS68C000 has a 16-bit data
bus and 24-bit address bus while the full architecture provides for 32-bit address and data-buses. It is completely code-
compatible with the HMOS TS68000, TS68008 8-bit data bus implementation of the TS68000 and the TS68020 32-bit
implementation of the architecture. Any user-mode programs written using the TS68C000 instruction set will run
unchanged on the TS68000, TS68008 and TS68020. This is possible because the user programming model is identical for
all processors and the instruction sets are proper sub-sets of the complete architecture.
Screening/Quality
This product is manufactured in full compliance with:
MIL-STD-883 class B
DESC drawing 5962-89462
e2v standards
C Suffix
DIL 64
Ceramic Package
F Suffix
CQFP 68
Ceramic Quad Flat Pack (on reque
E Suffix
LCCC 68
Leadless Ceramic Chip Carrier
R Suffix
PGA 68
Pin Grid Array
Visit our website: www.e2v.com
for the latest version of the datasheet
e2v semiconductors SAS 2007
0853B–HIREL–09/07

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