IC 64K X 4 STANDARD SRAM, 15 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL28,.5,30 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Base Number Matches | 1 |
| NM5104F15 | NM5104D12 | NM5104D15 | NM5104F12 | |
|---|---|---|---|---|
| 描述 | IC 64K X 4 STANDARD SRAM, 15 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM | IC 64K X 4 STANDARD SRAM, 12 ns, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Static RAM | IC 64K X 4 STANDARD SRAM, 15 ns, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Static RAM | IC 64K X 4 STANDARD SRAM, 12 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL28,.5,30 | DIP, DIP28,.4 | DIP, DIP28,.4 | DFP, FL28,.5,30 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | - | 12 ns | 15 ns | 12 ns |
| I/O 类型 | - | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | - | R-CDIP-T28 | R-CDIP-T28 | R-GDFP-F28 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 内存密度 | - | 262144 bit | 262144 bit | 262144 bi |
| 内存集成电路类型 | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | - | 4 | 4 | 4 |
| 负电源额定电压 | - | -5.2 V | -5.2 V | -5.2 V |
| 功能数量 | - | 1 | 1 | 1 |
| 端口数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 28 | 28 | 28 |
| 字数 | - | 65536 words | 65536 words | 65536 words |
| 字数代码 | - | 64000 | 64000 | 64000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C |
| 组织 | - | 64KX4 | 64KX4 | 64KX4 |
| 可输出 | - | NO | NO | NO |
| 封装主体材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | - | DIP | DIP | DFP |
| 封装等效代码 | - | DIP28,.4 | DIP28,.4 | FL28,.5,30 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | FLATPACK |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | -5.2 V | -5.2 V | -5.2 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 4.191 mm | 4.191 mm | 2.286 mm |
| 最大压摆率 | - | 0.25 mA | 0.25 mA | 0.25 mA |
| 表面贴装 | - | NO | NO | YES |
| 技术 | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | - | OTHER | OTHER | OTHER |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | - | 2.54 mm | 2.54 mm | 0.762 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 10.16 mm | 10.16 mm | 10.69 mm |
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